Frequency diverse e-pen for touch sensor and e-pen systems

ABSTRACT

An e-pen includes e-pen sensor electrodes (including a first and a second e-pen sensor electrode) and drive-sense circuits (DSCs) (including a first DSC and a second DSC. The first DSC drives a first e-pen signal having a first frequency via a first single line coupling to the first e-pen sensor electrode and simultaneously senses, via the first single line, the first e-pen signal. Based on e-pen/touch sensor device interaction, the first e-pen signal is coupled into at least one touch sensor electrode of the touch sensor device. The first DSC process the first e-pen signal to generate a first digital signal representative of a first electrical characteristic of the first e-pen sensor electrode. Similarly, the second DSC drives a second e-pen signal having a second frequency via a second single line coupling to the second e-pen sensor electrode and simultaneously senses, via the second single line, the second e-pen signal.

CROSS REFERENCE TO RELATED PATENTS

The present U.S. Utility patent Application claims priority pursuant to35 U.S.C. § 120 as a continuation of U.S. Utility application Ser. No.17/083,998, entitled “Frequency diverse e-pen for touch sensor and e-pensystems,” filed Oct. 29, 2020, pending, which claims priority pursuantto 35 U.S.C. § 120 as a continuation of U.S. Utility application Ser.No. 16/195,041, entitled “Frequency diverse e-pen for touch sensor ande-pen systems,” filed Nov. 19, 2018, now issued as U.S. Pat. No.10,852,857 on Dec. 1, 2020, all of which are hereby incorporated hereinby reference in their entirety and made part of the present U.S. Utilitypatent application for all purposes.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

Not Applicable.

INCORPORATION-BY-REFERENCE OF MATERIAL SUBMITTED ON A COMPACT DISC

Not Applicable.

BACKGROUND OF THE INVENTION Technical Field of the Invention

This invention relates generally to data communication systems and moreparticularly to sensed data collection and/or communication.

Description of Related Art

Sensors are used in a wide variety of applications ranging from in-homeautomation, to industrial systems, to health care, to transportation,and so on. For example, sensors are placed in bodies, automobiles,airplanes, boats, ships, trucks, motorcycles, cell phones, televisions,touch-screens, industrial plants, appliances, motors, checkout counters,etc. for the variety of applications.

In general, a sensor converts a physical quantity into an electrical oroptical signal. For example, a sensor converts a physical phenomenon,such as a biological condition, a chemical condition, an electriccondition, an electromagnetic condition, a temperature, a magneticcondition, mechanical motion (position, velocity, acceleration, force,pressure), an optical condition, and/or a radioactivity condition, intoan electrical signal.

A sensor includes a transducer, which functions to convert one form ofenergy (e.g., force) into another form of energy (e.g., electricalsignal). There are a variety of transducers to support the variousapplications of sensors. For example, a transducer is capacitor, apiezoelectric transducer, a piezoresistive transducer, a thermaltransducer, a thermal-couple, a photoconductive transducer such as aphotoresistor, a photodiode, and/or phototransistor.

A sensor circuit is coupled to a sensor to provide the sensor with powerand to receive the signal representing the physical phenomenon from thesensor. The sensor circuit includes at least three electricalconnections to the sensor: one for a power supply; another for a commonvoltage reference (e.g., ground); and a third for receiving the signalrepresenting the physical phenomenon. The signal representing thephysical phenomenon will vary from the power supply voltage to ground asthe physical phenomenon changes from one extreme to another (for therange of sensing the physical phenomenon).

The sensor circuits provide the received sensor signals to one or morecomputing devices for processing. A computing device is known tocommunicate data, process data, and/or store data. The computing devicemay be a cellular phone, a laptop, a tablet, a personal computer (PC), awork station, a video game device, a server, and/or a data center thatsupport millions of web searches, stock trades, or on-line purchasesevery hour.

The computing device processes the sensor signals for a variety ofapplications. For example, the computing device processes sensor signalsto determine temperatures of a variety of items in a refrigerated truckduring transit. As another example, the computing device processes thesensor signals to determine a touch on a touch screen. As yet anotherexample, the computing device processes the sensor signals to determinevarious data points in a production line of a product.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING(S)

FIG. 1 is a schematic block diagram of an embodiment of a communicationsystem in accordance with the present invention;

FIG. 2 is a schematic block diagram of an embodiment of a computingdevice in accordance with the present invention;

FIG. 3 is a schematic block diagram of another embodiment of a computingdevice in accordance with the present invention;

FIG. 4 is a schematic block diagram of another embodiment of a computingdevice in accordance with the present invention;

FIG. 5A is a schematic plot diagram of a computing subsystem inaccordance with the present invention;

FIG. 5B is a schematic block diagram of another embodiment of acomputing subsystem in accordance with the present invention;

FIG. 5C is a schematic block diagram of another embodiment of acomputing subsystem in accordance with the present invention;

FIG. 5D is a schematic block diagram of another embodiment of acomputing subsystem in accordance with the present invention;

FIG. 5E is a schematic block diagram of another embodiment of acomputing subsystem in accordance with the present invention;

FIG. 6 is a schematic block diagram of a drive center circuit inaccordance with the present invention;

FIG. 6A is a schematic block diagram of another embodiment of a drivesense circuit in accordance with the present invention;

FIG. 7 is an example of a power signal graph in accordance with thepresent invention;

FIG. 8 is an example of a sensor graph in accordance with the presentinvention;

FIG. 9 is a schematic block diagram of another example of a power signalgraph in accordance with the present invention;

FIG. 10 is a schematic block diagram of another example of a powersignal graph in accordance with the present invention;

FIG. 11 is a schematic block diagram of another example of a powersignal graph in accordance with the present invention;

FIG. 11A is a schematic block diagram of another example of a powersignal graph in accordance with the present invention;

FIG. 12 is a schematic block diagram of an embodiment of a power signalchange detection circuit in accordance with the present invention;

FIG. 13 is a schematic block diagram of another embodiment of adrive-sense circuit in accordance with the present invention;

FIG. 14 is a schematic block diagram of an embodiment of a computingdevice operative with an e-pen (an electronic or electrical pen withelectrical and/or electronic functionality) in accordance with thepresent invention;

FIG. 15 is a schematic block diagram of another embodiment of acomputing device operative with an e-pen in accordance with the presentinvention;

FIG. 16 is a schematic block diagram of embodiments of computing devicesoperative with different types of e-pens in accordance with the presentinvention;

FIG. 17A is a schematic block diagram of an embodiment of an e-pen inaccordance with the present invention;

FIG. 17B is a schematic block diagram of another embodiment of an e-penin accordance with the present invention;

FIG. 18A is a schematic block diagram of another embodiment of an e-penin accordance with the present invention;

FIG. 18B is a schematic block diagram of another embodiment of an e-penin accordance with the present invention;

FIG. 19 is a schematic block diagram of embodiments of different sensorelectrode arrangements within e-pens in accordance with the presentinvention;

FIG. 20 is a schematic block diagram of an embodiment of an e-peninteracting touch sensors (e.g., touch sensor electrodes) in accordancewith the present invention;

FIG. 21 is a schematic block diagram of another embodiment of an e-peninteracting with touch sensors (e.g., touch sensor electrodes) inaccordance with the present invention;

FIG. 22 is a schematic block diagram of another embodiment of an e-peninteracting with touch sensors (e.g., touch sensor electrodes) inaccordance with the present invention;

FIG. 23 is a schematic block diagram of an embodiment of a method forexecution by one or more devices in accordance with the presentinvention;

FIG. 24 is a schematic block diagram of another embodiment of a methodfor execution by one or more devices in accordance with the presentinvention;

FIG. 25 is a schematic block diagram of another embodiment of a methodfor execution by one or more devices in accordance with the presentinvention;

FIG. 26 is a schematic block diagram of another embodiment of a methodfor execution by one or more devices in accordance with the presentinvention;

FIG. 27 is a schematic block diagram of an embodiment 2700 ofdirectional mapping determination (e.g., North, South, East, and West(NSEW)) and orientation determination of an e-pen in accordance with thepresent invention;

FIG. 28 is a schematic block diagram of another embodiment of a methodfor execution by one or more devices in accordance with the presentinvention;

FIG. 29 is a schematic block diagram of another embodiment of a methodfor execution by one or more devices in accordance with the presentinvention;

FIG. 30 is a schematic block diagram of another embodiment of a methodfor execution by one or more devices in accordance with the presentinvention;

FIG. 31 is a schematic block diagram of another embodiment of a methodfor execution by one or more devices in accordance with the presentinvention;

FIG. 32A is a schematic block diagram of an embodiment of signalassignment to signals associated with e-pen sensor electrodes inaccordance with the present invention;

FIG. 32B is a schematic block diagram of an embodiment of frequencyassignment to signals associated with e-pen sensor electrodes inaccordance with the present invention;

FIG. 33A is a schematic block diagram of an embodiment of forward errorcorrection (FEC)/error checking and correction (ECC) assignment tosignals associated with e-pen sensor electrodes in accordance with thepresent invention;

FIG. 33B is a schematic block diagram of another embodiment of FEC/ECCassignment to signals associated with e-pen sensor electrodes inaccordance with the present invention;

FIG. 34A is a schematic block diagram of an embodiment of differenttypes of modulations or modulation coding sets (MCSs) used formodulation of different bit or symbol streams;

FIG. 34B is a schematic block diagram of an embodiment of differentlabeling of constellation points in a constellation;

FIG. 34C is a schematic block diagram of an embodiment of differentarrangements of constellation points in a type of constellation;

FIG. 34D is a schematic block diagram of an embodiment of adaptivesymbol mapping/modulation for different transmission streams;

FIG. 34E is a schematic block diagram of an embodiment of adaptivesymbol mapping/modulation for different transmission streams;

FIG. 35 is a schematic block diagram of another embodiment of a methodfor execution by one or more devices in accordance with the presentinvention;

FIG. 36 is a schematic block diagram of another embodiment of a methodfor execution by one or more devices in accordance with the presentinvention; and

FIG. 37 is a schematic block diagram of another embodiment of a methodfor execution by one or more devices in accordance with the presentinvention.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 is a schematic block diagram of an embodiment of a communicationsystem 10 that includes a plurality of computing, devices 12-10, one ormore servers 22, one or more databases 24, one or more networks 26, aplurality of drive-sense circuits 28, a plurality of sensors 30, and aplurality of actuators 32. Computing devices 14 include a touch screen16 with sensors and drive-sensor circuits and computing devices 18include a touch & tactic screen 20 that includes sensors, actuators, anddrive-sense circuits.

A sensor 30 functions to convert a physical input into an electricaloutput and/or an optical output. The physical input of a sensor may beone of a variety of physical input conditions. For example, the physicalcondition includes one or more of, but is not limited to, acoustic waves(e.g., amplitude, phase, polarization, spectrum, and/or wave velocity);a biological and/or chemical condition (e.g., fluid concentration,level, composition, etc.); an electric condition (e.g., charge, voltage,current, conductivity, permittivity, eclectic field, which includesamplitude, phase, and/or polarization); a magnetic condition (e.g.,flux, permeability, magnetic field, which amplitude, phase, and/orpolarization); an optical condition (e.g., refractive index,reflectivity, absorption, etc.); a thermal condition (e.g., temperature,flux, specific heat, thermal conductivity, etc.); and a mechanicalcondition (e.g., position, velocity, acceleration, force, strain,stress, pressure, torque, etc.). For example, piezoelectric sensorconverts force or pressure into an eclectic signal. As another example,a microphone converts audible acoustic waves into electrical signals.

There are a variety of types of sensors to sense the various types ofphysical conditions. Sensor types include, but are not limited to,capacitor sensors, inductive sensors, accelerometers, piezoelectricsensors, light sensors, magnetic field sensors, ultrasonic sensors,temperature sensors, infrared (IR) sensors, touch sensors, proximitysensors, pressure sensors, level sensors, smoke sensors, and gassensors. In many ways, sensors function as the interface between thephysical world and the digital world by converting real world conditionsinto digital signals that are then processed by computing devices for avast number of applications including, but not limited to, medicalapplications, production automation applications, home environmentcontrol, public safety, and so on.

The various types of sensors have a variety of sensor characteristicsthat are factors in providing power to the sensors, receiving signalsfrom the sensors, and/or interpreting the signals from the sensors. Thesensor characteristics include resistance, reactance, powerrequirements, sensitivity, range, stability, repeatability, linearity,error, response time, and/or frequency response. For example, theresistance, reactance, and/or power requirements are factors indetermining drive circuit requirements. As another example, sensitivity,stability, and/or linear are factors for interpreting the measure of thephysical condition based on the received electrical and/or opticalsignal (e.g., measure of temperature, pressure, etc.).

An actuator 32 converts an electrical input into a physical output. Thephysical output of an actuator may be one of a variety of physicaloutput conditions. For example, the physical output condition includesone or more of, but is not limited to, acoustic waves (e.g., amplitude,phase, polarization, spectrum, and/or wave velocity); a magneticcondition (e.g., flux, permeability, magnetic field, which amplitude,phase, and/or polarization); a thermal condition (e.g., temperature,flux, specific heat, thermal conductivity, etc.); and a mechanicalcondition (e.g., position, velocity, acceleration, force, strain,stress, pressure, torque, etc.). As an example, a piezoelectric actuatorconverts voltage into force or pressure. As another example, a speakerconverts electrical signals into audible acoustic waves.

An actuator 32 may be one of a variety of actuators. For example, anactuator 32 is one of a comb drive, a digital micro-mirror device, anelectric motor, an electroactive polymer, a hydraulic cylinder, apiezoelectric actuator, a pneumatic actuator, a screw jack, aservomechanism, a solenoid, a stepper motor, a shape-memory allow, athermal bimorph, and a hydraulic actuator.

The various types of actuators have a variety of actuatorscharacteristics that are factors in providing power to the actuator andsending signals to the actuators for desired performance. The actuatorcharacteristics include resistance, reactance, power requirements,sensitivity, range, stability, repeatability, linearity, error, responsetime, and/or frequency response. For example, the resistance, reactance,and power requirements are factors in determining drive circuitrequirements. As another example, sensitivity, stability, and/or linearare factors for generating the signaling to send to the actuator toobtain the desired physical output condition.

The computing devices 12, 14, and 18 may each be a portable computingdevice and/or a fixed computing device. A portable computing device maybe a social networking device, a gaming device, a cell phone, a smartphone, a digital assistant, a digital music player, a digital videoplayer, a laptop computer, a handheld computer, a tablet, a video gamecontroller, and/or any other portable device that includes a computingcore. A fixed computing device may be a computer (PC), a computerserver, a cable set-top box, a satellite receiver, a television set, aprinter, a fax machine, home entertainment equipment, a video gameconsole, and/or any type of home or office computing equipment. Thecomputing devices 12, 14, and 18 will be discussed in greater detailwith reference to one or more of FIGS. 2-4 .

A server 22 is a special type of computing device that is optimized forprocessing large amounts of data requests in parallel. A server 22includes similar components to that of the computing devices 12, 14,and/or 18 with more robust processing modules, more main memory, and/ormore hard drive memory (e.g., solid state, hard drives, etc.). Further,a server 22 is typically accessed remotely; as such it does notgenerally include user input devices and/or user output devices. Inaddition, a server may be a standalone separate computing device and/ormay be a cloud computing device.

A database 24 is a special type of computing device that is optimizedfor large scale data storage and retrieval. A database 24 includessimilar components to that of the computing devices 12, 14, and/or 18with more hard drive memory (e.g., solid state, hard drives, etc.) andpotentially with more processing modules and/or main memory. Further, adatabase 24 is typically accessed remotely; as such it does notgenerally include user input devices and/or user output devices. Inaddition, a database 24 may be a standalone separate computing deviceand/or may be a cloud computing device.

The network 26 includes one more local area networks (LAN) and/or one ormore wide area networks WAN), which may be a public network and/or aprivate network. A LAN may be a wireless-LAN (e.g., Wi-Fi access point,Bluetooth, ZigBee, etc.) and/or a wired network (e.g., Firewire,Ethernet, etc.). A WAN may be a wired and/or wireless WAN. For example,a LAN may be a personal home or business's wireless network and a WAN isthe Internet, cellular telephone infrastructure, and/or satellitecommunication infrastructure.

In an example of operation, computing device 12-1 communicates with aplurality of drive-sense circuits 28, which, in turn, communicate with aplurality of sensors 30. The sensors 30 and/or the drive-sense circuits28 are within the computing device 12-1 and/or external to it. Forexample, the sensors 30 may be external to the computing device 12-1 andthe drive-sense circuits are within the computing device 12-1. Asanother example, both the sensors 30 and the drive-sense circuits 28 areexternal to the computing device 12-1. When the drive-sense circuits 28are external to the computing device, they are coupled to the computingdevice 12-1 via wired and/or wireless communication links as will bediscussed in greater detail with reference to one or more of FIGS.5A-5C.

The computing device 12-1 communicates with the drive-sense circuits 28to; (a) turn them on, (b) obtain data from the sensors (individuallyand/or collectively), (c) instruct the drive sense circuit on how tocommunicate the sensed data to the computing device 12-1, (d) providesignaling attributes (e.g., DC level, AC level, frequency, power level,regulated current signal, regulated voltage signal, regulation of animpedance, frequency patterns for various sensors, different frequenciesfor different sensing applications, etc.) to use with the sensors,and/or (e) provide other commands and/or instructions.

As a specific example, the sensors 30 are distributed along a pipelineto measure flow rate and/or pressure within a section of the pipeline.The drive-sense circuits 28 have their own power source (e.g., battery,power supply, etc.) and are proximally located to their respectivesensors 30. At desired time intervals (milliseconds, seconds, minutes,hours, etc.), the drive-sense circuits 28 provide a regulated sourcesignal or a power signal to the sensors 30. An electrical characteristicof the sensor 30 affects the regulated source signal or power signal,which is reflective of the condition (e.g., the flow rate and/or thepressure) that sensor is sensing.

The drive-sense circuits 28 detect the effects on the regulated sourcesignal or power signals as a result of the electrical characteristics ofthe sensors. The drive-sense circuits 28 then generate signalsrepresentative of change to the regulated source signal or power signalbased on the detected effects on the power signals. The changes to theregulated source signals or power signals are representative of theconditions being sensed by the sensors 30.

The drive-sense circuits 28 provide the representative signals of theconditions to the computing device 12-1. A representative signal may bean analog signal or a digital signal. In either case, the computingdevice 12-1 interprets the representative signals to determine thepressure and/or flow rate at each sensor location along the pipeline.The computing device may then provide this information to the server 22,the database 24, and/or to another computing device for storing and/orfurther processing.

As another example of operation, computing device 12-2 is coupled to adrive-sense circuit 28, which is, in turn, coupled to a senor 30. Thesensor 30 and/or the drive-sense circuit 28 may be internal and/orexternal to the computing device 12-2. In this example, the sensor 30 issensing a condition that is particular to the computing device 12-2. Forexample, the sensor 30 may be a temperature sensor, an ambient lightsensor, an ambient noise sensor, etc. As described above, wheninstructed by the computing device 12-2 (which may be a default settingfor continuous sensing or at regular intervals), the drive-sense circuit28 provides the regulated source signal or power signal to the sensor 30and detects an effect to the regulated source signal or power signalbased on an electrical characteristic of the sensor. The drive-sensecircuit generates a representative signal of the affect and sends it tothe computing device 12-2.

In another example of operation, computing device 12-3 is coupled to aplurality of drive-sense circuits 28 that are coupled to a plurality ofsensors 30 and is coupled to a plurality of drive-sense circuits 28 thatare coupled to a plurality of actuators 32. The generally functionalityof the drive-sense circuits 28 coupled to the sensors 30 in accordancewith the above description.

Since an actuator 32 is essentially an inverse of a sensor in that anactuator converts an electrical signal into a physical condition, whilea sensor converts a physical condition into an electrical signal, thedrive-sense circuits 28 can be used to power actuators 32. Thus, in thisexample, the computing device 12-3 provides actuation signals to thedrive-sense circuits 28 for the actuators 32. The drive-sense circuitsmodulate the actuation signals on to power signals or regulated controlsignals, which are provided to the actuators 32. The actuators 32 arepowered from the power signals or regulated control signals and producethe desired physical condition from the modulated actuation signals.

As another example of operation, computing device 12-x is coupled to adrive-sense circuit 28 that is coupled to a sensor 30 and is coupled toa drive-sense circuit 28 that is coupled to an actuator 32. In thisexample, the sensor 30 and the actuator 32 are for use by the computingdevice 12-x. For example, the sensor 30 may be a piezoelectricmicrophone and the actuator 32 may be a piezoelectric speaker.

FIG. 2 is a schematic block diagram of an embodiment of a computingdevice 12 (e.g., any one of 12-1 through 12-x). The computing device 12includes a core control module 40, one or more processing modules 42,one or more main memories 44, cache memory 46, a video graphicsprocessing module 48, a display 50, an Input-Output (I/O) peripheralcontrol module 52, one or more input interface modules 56, one or moreoutput interface modules 58, one or more network interface modules 60,and one or more memory interface modules 62. A processing module 42 isdescribed in greater detail at the end of the detailed description ofthe invention section and, in an alternative embodiment, has a directionconnection to the main memory 44. In an alternate embodiment, the corecontrol module 40 and the I/O and/or peripheral control module 52 areone module, such as a chipset, a quick path interconnect (QPI), and/oran ultra-path interconnect (UPI).

Each of the main memories 44 includes one or more Random Access Memory(RAM) integrated circuits, or chips. For example, a main memory 44includes four DDR4 (4^(th) generation of double data rate) RAM chips,each running at a rate of 2,400 MHz. In general, the main memory 44stores data and operational instructions most relevant for theprocessing module 42. For example, the core control module 40coordinates the transfer of data and/or operational instructions fromthe main memory 44 and the memory 64-66. The data and/or operationalinstructions retrieve from memory 64-66 are the data and/or operationalinstructions requested by the processing module or will most likely beneeded by the processing module. When the processing module is done withthe data and/or operational instructions in main memory, the corecontrol module 40 coordinates sending updated data to the memory 64-66for storage.

The memory 64-66 includes one or more hard drives, one or more solidstate memory chips, and/or one or more other large capacity storagedevices that, in comparison to cache memory and main memory devices,is/are relatively inexpensive with respect to cost per amount of datastored. The memory 64-66 is coupled to the core control module 40 viathe I/O and/or peripheral control module 52 and via one or more memoryinterface modules 62. In an embodiment, the I/O and/or peripheralcontrol module 52 includes one or more Peripheral Component Interface(PCI) buses to which peripheral components connect to the core controlmodule 40. A memory interface module 62 includes a software driver and ahardware connector for coupling a memory device to the I/O and/orperipheral control module 52. For example, a memory interface 62 is inaccordance with a Serial Advanced Technology Attachment (SATA) port.

The core control module 40 coordinates data communications between theprocessing module(s) 42 and the network(s) 26 via the I/O and/orperipheral control module 52, the network interface module(s) 60, and anetwork card 68 or 70. A network card 68 or 70 includes a wirelesscommunication unit or a wired communication unit. A wirelesscommunication unit includes a wireless local area network (WLAN)communication device, a cellular communication device, a Bluetoothdevice, and/or a ZigBee communication device. A wired communication unitincludes a Gigabit LAN connection, a Firewire connection, and/or aproprietary computer wired connection. A network interface module 60includes a software driver and a hardware connector for coupling thenetwork card to the I/O and/or peripheral control module 52. Forexample, the network interface module 60 is in accordance with one ormore versions of IEEE 802.11, cellular telephone protocols, 10/100/1000Gigabit LAN protocols, etc.

The core control module 40 coordinates data communications between theprocessing module(s) 42 and input device(s) 72 via the input interfacemodule(s) 56 and the I/O and/or peripheral control module 52. An inputdevice 72 includes a keypad, a keyboard, control switches, a touchpad, amicrophone, a camera, etc. An input interface module 56 includes asoftware driver and a hardware connector for coupling an input device tothe I/O and/or peripheral control module 52. In an embodiment, an inputinterface module 56 is in accordance with one or more Universal SerialBus (USB) protocols.

The core control module 40 coordinates data communications between theprocessing module(s) 42 and output device(s) 74 via the output interfacemodule(s) 58 and the I/O and/or peripheral control module 52. An outputdevice 74 includes a speaker, etc. An output interface module 58includes a software driver and a hardware connector for coupling anoutput device to the I/O and/or peripheral control module 52. In anembodiment, an output interface module 56 is in accordance with one ormore audio codec protocols.

The processing module 42 communicates directly with a video graphicsprocessing module 48 to display data on the display 50. The display 50includes an LED (light emitting diode) display, an LCD (liquid crystaldisplay), and/or other type of display technology. The display has aresolution, an aspect ratio, and other features that affect the qualityof the display. The video graphics processing module 48 receives datafrom the processing module 42, processes the data to produce rendereddata in accordance with the characteristics of the display, and providesthe rendered data to the display 50.

FIG. 2 further illustrates sensors 30 and actuators 32 coupled todrive-sense circuits 28, which are coupled to the input interface module56 (e.g., USB port). Alternatively, one or more of the drive-sensecircuits 28 is coupled to the computing device via a wireless networkcard (e.g., WLAN) or a wired network card (e.g., Gigabit LAN). While notshown, the computing device 12 further includes a BIOS (Basic InputOutput System) memory coupled to the core control module 40.

FIG. 3 is a schematic block diagram of another embodiment of a computingdevice 14 that includes a core control module 40, one or more processingmodules 42, one or more main memories 44, cache memory 46, a videographics processing module 48, a touch screen 16, an Input-Output (I/O)peripheral control module 52, one or more input interface modules 56,one or more output interface modules 58, one or more network interfacemodules 60, and one or more memory interface modules 62. The touchscreen 16 includes a touch screen display 80, a plurality of sensors 30,a plurality of drive-sense circuits (DSC), and a touch screen processingmodule 82.

Computing device 14 operates similarly to computing device 12 of FIG. 2with the addition of a touch screen as an input device. The touch screenincludes a plurality of sensors (e.g., electrodes, capacitor sensingcells, capacitor sensors, inductive sensor, etc.) to detect a proximaltouch of the screen. For example, when one or more fingers touches thescreen, capacitance of sensors proximal to the touch(es) are affected(e.g., impedance changes). The drive-sense circuits (DSC) coupled to theaffected sensors detect the change and provide a representation of thechange to the touch screen processing module 82, which may be a separateprocessing module or integrated into the processing module 42.

The touch screen processing module 82 processes the representativesignals from the drive-sense circuits (DSC) to determine the location ofthe touch(es). This information is inputted to the processing module 42for processing as an input. For example, a touch represents a selectionof a button on screen, a scroll function, a zoom in-out function, etc.

FIG. 4 is a schematic block diagram of another embodiment of a computingdevice 18 that includes a core control module 40, one or more processingmodules 42, one or more main memories 44, cache memory 46, a videographics processing module 48, a touch and tactile screen 20, anInput-Output (I/O) peripheral control module 52, one or more inputinterface modules 56, one or more output interface modules 58, one ormore network interface modules 60, and one or more memory interfacemodules 62. The touch and tactile screen 20 includes a touch and tactilescreen display 90, a plurality of sensors 30, a plurality of actuators32, a plurality of drive-sense circuits (DSC), a touch screen processingmodule 82, and a tactile screen processing module 92.

Computing device 18 operates similarly to computing device 14 of FIG. 3with the addition of a tactile aspect to the screen 20 as an outputdevice. The tactile portion of the screen 20 includes the plurality ofactuators (e.g., piezoelectric transducers to create vibrations,solenoids to create movement, etc.) to provide a tactile feel to thescreen 20. To do so, the processing module creates tactile data, whichis provided to the appropriate drive-sense circuits (DSC) via thetactile screen processing module 92, which may be a stand-aloneprocessing module or integrated into processing module 42. Thedrive-sense circuits (DSC) convert the tactile data into drive-actuatesignals and provide them to the appropriate actuators to create thedesired tactile feel on the screen 20.

FIG. 5A is a schematic plot diagram of a computing subsystem 25 thatincludes a sensed data processing module 65, a plurality ofcommunication modules 61A-x, a plurality of processing modules 42A-x, aplurality of drive sense circuits 28, and a plurality of sensors 1-x,which may be sensors 30 of FIG. 1 . The sensed data processing module 65is one or more processing modules within one or more servers 22 and/orone more processing modules in one or more computing devices that aredifferent than the computing devices in which processing modules 42A-xreside.

A drive-sense circuit 28 (or multiple drive-sense circuits), aprocessing module (e.g., 41A), and a communication module (e.g., 61A)are within a common computing device. Each grouping of a drive-sensecircuit(s), processing module, and communication module is in a separatecomputing device. A communication module 61A-x is constructed inaccordance with one or more wired communication protocol and/or one ormore wireless communication protocols that is/are in accordance with theone or more of the Open System Interconnection (OSI) model, theTransmission Control Protocol/Internet Protocol (TCP/IP) model, andother communication protocol module.

In an example of operation, a processing module (e.g., 42A) provides acontrol signal to its corresponding drive-sense circuit 28. Theprocessing module 42 A may generate the control signal, receive it fromthe sensed data processing module 65, or receive an indication from thesensed data processing module 65 to generate the control signal. Thecontrol signal enables the drive-sense circuit 28 to provide a drivesignal to its corresponding sensor. The control signal may furtherinclude a reference signal having one or more frequency components tofacilitate creation of the drive signal and/or interpreting a sensedsignal received from the sensor.

Based on the control signal, the drive-sense circuit 28 provides thedrive signal to its corresponding sensor (e.g., 1) on a drive & senseline. While receiving the drive signal (e.g., a power signal, aregulated source signal, etc.), the sensor senses a physical condition1-x (e.g., acoustic waves, a biological condition, a chemical condition,an electric condition, a magnetic condition, an optical condition, athermal condition, and/or a mechanical condition). As a result of thephysical condition, an electrical characteristic (e.g., impedance,voltage, current, capacitance, inductance, resistance, reactance, etc.)of the sensor changes, which affects the drive signal. Note that if thesensor is an optical sensor, it converts a sensed optical condition intoan electrical characteristic.

The drive-sense circuit 28 detects the effect on the drive signal viathe drive & sense line and processes the affect to produce a signalrepresentative of power change, which may be an analog or digitalsignal. The processing module 42A receives the signal representative ofpower change, interprets it, and generates a value representing thesensed physical condition. For example, if the sensor is sensingpressure, the value representing the sensed physical condition is ameasure of pressure (e.g., x PSI (pounds per square inch)).

In accordance with a sensed data process function (e.g., algorithm,application, etc.), the sensed data processing module 65 gathers thevalues representing the sensed physical conditions from the processingmodules. Since the sensors 1-x may be the same type of sensor (e.g., apressure sensor), may each be different sensors, or a combinationthereof; the sensed physical conditions may be the same, may each bedifferent, or a combination thereof. The sensed data processing module65 processes the gathered values to produce one or more desired results.For example, if the computing subsystem 25 is monitoring pressure alonga pipeline, the processing of the gathered values indicates that thepressures are all within normal limits or that one or more of the sensedpressures is not within normal limits.

As another example, if the computing subsystem 25 is used in amanufacturing facility, the sensors are sensing a variety of physicalconditions, such as acoustic waves (e.g., for sound proofing, soundgeneration, ultrasound monitoring, etc.), a biological condition (e.g.,a bacterial contamination, etc.) a chemical condition (e.g.,composition, gas concentration, etc.), an electric condition (e.g.,current levels, voltage levels, electro-magnetic interference, etc.), amagnetic condition (e.g., induced current, magnetic field strength,magnetic field orientation, etc.), an optical condition (e.g., ambientlight, infrared, etc.), a thermal condition (e.g., temperature, etc.),and/or a mechanical condition (e.g., physical position, force, pressure,acceleration, etc.).

The computing subsystem 25 may further include one or more actuators inplace of one or more of the sensors and/or in addition to the sensors.When the computing subsystem 25 includes an actuator, the correspondingprocessing module provides an actuation control signal to thecorresponding drive-sense circuit 28. The actuation control signalenables the drive-sense circuit 28 to provide a drive signal to theactuator via a drive & actuate line (e.g., similar to the drive & senseline, but for the actuator). The drive signal includes one or morefrequency components and/or amplitude components to facilitate a desiredactuation of the actuator.

In addition, the computing subsystem 25 may include an actuator andsensor working in concert. For example, the sensor is sensing thephysical condition of the actuator. In this example, a drive-sensecircuit provides a drive signal to the actuator and another drive sensesignal provides the same drive signal, or a scaled version of it, to thesensor. This allows the sensor to provide near immediate and continuoussensing of the actuator's physical condition. This further allows forthe sensor to operate at a first frequency and the actuator to operateat a second frequency.

In an embodiment, the computing subsystem is a stand-alone system for awide variety of applications (e.g., manufacturing, pipelines, testing,monitoring, security, etc.). In another embodiment, the computingsubsystem 25 is one subsystem of a plurality of subsystems forming alarger system. For example, different subsystems are employed based ongeographic location. As a specific example, the computing subsystem 25is deployed in one section of a factory and another computing subsystemis deployed in another part of the factory. As another example,different subsystems are employed based function of the subsystems. As aspecific example, one subsystem monitors a city's traffic lightoperation and another subsystem monitors the city's sewage treatmentplants.

Regardless of the use and/or deployment of the computing system, thephysical conditions it is sensing, and/or the physical conditions it isactuating, each sensor and each actuator (if included) is driven andsensed by a single line as opposed to separate drive and sense lines.This provides many advantages including, but not limited to, lower powerrequirements, better ability to drive high impedance sensors, lower lineto line interference, and/or concurrent sensing functions.

FIG. 5B is a schematic block diagram of another embodiment of acomputing subsystem 25 that includes a sensed data processing module 65,a communication module 61, a plurality of processing modules 42A-x, aplurality of drive sense circuits 28, and a plurality of sensors 1-x,which may be sensors 30 of FIG. 1 . The sensed data processing module 65is one or more processing modules within one or more servers 22 and/orone more processing modules in one or more computing devices that aredifferent than the computing device, devices, in which processingmodules 42A-x reside.

In an embodiment, the drive-sense circuits 28, the processing modules,and the communication module are within a common computing device. Forexample, the computing device includes a central processing unit thatincludes a plurality of processing modules. The functionality andoperation of the sensed data processing module 65, the communicationmodule 61, the processing modules 42A-x, the drive sense circuits 28,and the sensors 1-x are as discussed with reference to FIG. 5A.

FIG. 5C is a schematic block diagram of another embodiment of acomputing subsystem 25 that includes a sensed data processing module 65,a communication module 61, a processing module 42, a plurality of drivesense circuits 28, and a plurality of sensors 1-x, which may be sensors30 of FIG. 1 . The sensed data processing module 65 is one or moreprocessing modules within one or more servers 22 and/or one moreprocessing modules in one or more computing devices that are differentthan the computing device in which the processing module 42 resides.

In an embodiment, the drive-sense circuits 28, the processing module,and the communication module are within a common computing device. Thefunctionality and operation of the sensed data processing module 65, thecommunication module 61, the processing module 42, the drive sensecircuits 28, and the sensors 1-x are as discussed with reference to FIG.5A.

FIG. 5D is a schematic block diagram of another embodiment of acomputing subsystem 25 that includes a processing module 42, a referencesignal circuit 100, a plurality of drive sense circuits 28, and aplurality of sensors 30. The processing module 42 includes a drive-senseprocessing block 104, a drive-sense control block 102, and a referencecontrol block 106. Each block 102-106 of the processing module 42 may beimplemented via separate modules of the processing module, may be acombination of software and hardware within the processing module,and/or may be field programmable modules within the processing module42.

In an example of operation, the drive-sense control block 104 generatesone or more control signals to activate one or more of the drive-sensecircuits 28. For example, the drive-sense control block 102 generates acontrol signal that enables of the drive-sense circuits 28 for a givenperiod of time (e.g., 1 second, 1 minute, etc.). As another example, thedrive-sense control block 102 generates control signals to sequentiallyenable the drive-sense circuits 28. As yet another example, thedrive-sense control block 102 generates a series of control signals toperiodically enable the drive-sense circuits 28 (e.g., enabled onceevery second, every minute, every hour, etc.).

Continuing with the example of operation, the reference control block106 generates a reference control signal that it provides to thereference signal circuit 100. The reference signal circuit 100generates, in accordance with the control signal, one or more referencesignals for the drive-sense circuits 28. For example, the control signalis an enable signal, which, in response, the reference signal circuit100 generates a pre-programmed reference signal that it provides to thedrive-sense circuits 28. In another example, the reference signalcircuit 100 generates a unique reference signal for each of thedrive-sense circuits 28. In yet another example, the reference signalcircuit 100 generates a first unique reference signal for each of thedrive-sense circuits 28 in a first group and generates a second uniquereference signal for each of the drive-sense circuits 28 in a secondgroup.

The reference signal circuit 100 may be implemented in a variety ofways. For example, the reference signal circuit 100 includes a DC(direct current) voltage generator, an AC voltage generator, and avoltage combining circuit. The DC voltage generator generates a DCvoltage at a first level and the AC voltage generator generates an ACvoltage at a second level, which is less than or equal to the firstlevel. The voltage combining circuit combines the DC and AC voltages toproduce the reference signal. As examples, the reference signal circuit100 generates a reference signal similar to the signals shown in FIG. 7, which will be subsequently discussed.

As another example, the reference signal circuit 100 includes a DCcurrent generator, an AC current generator, and a current combiningcircuit. The DC current generator generates a DC current a first currentlevel and the AC current generator generates an AC current at a secondcurrent level, which is less than or equal to the first current level.The current combining circuit combines the DC and AC currents to producethe reference signal.

Returning to the example of operation, the reference signal circuit 100provides the reference signal, or signals, to the drive-sense circuits28. When a drive-sense circuit 28 is enabled via a control signal fromthe drive sense control block 102, it provides a drive signal to itscorresponding sensor 30. As a result of a physical condition, anelectrical characteristic of the sensor is changed, which affects thedrive signal. Based on the detected effect on the drive signal and thereference signal, the drive-sense circuit 28 generates a signalrepresentative of the effect on the drive signal.

The drive-sense circuit provides the signal representative of the effecton the drive signal to the drive-sense processing block 104. Thedrive-sense processing block 104 processes the representative signal toproduce a sensed value 97 of the physical condition (e.g., a digitalvalue that represents a specific temperature, a specific pressure level,etc.). The processing module 42 provides the sensed value 97 to anotherapplication running on the computing device, to another computingdevice, and/or to a server 22.

FIG. 5E is a schematic block diagram of another embodiment of acomputing subsystem 25 that includes a processing module 42, a pluralityof drive sense circuits 28, and a plurality of sensors 30. Thisembodiment is similar to the embodiment of FIG. 5D with thefunctionality of the drive-sense processing block 104, a drive-sensecontrol block 102, and a reference control block 106 shown in greaterdetail. For instance, the drive-sense control block 102 includesindividual enable/disable blocks 102-1 through 102-y. An enable/disableblock functions to enable or disable a corresponding drive-sense circuitin a manner as discussed above with reference to FIG. 5D.

The drive-sense processing block 104 includes variance determiningmodules 104-1 a through y and variance interpreting modules 104-2 athrough y. For example, variance determining module 104-1 a receives,from the corresponding drive-sense circuit 28, a signal representativeof a physical condition sensed by a sensor. The variance determiningmodule 104-1 a functions to determine a difference from the signalrepresenting the sensed physical condition with a signal representing aknown, or reference, physical condition. The variance interpretingmodule 104-1 b interprets the difference to determine a specific valuefor the sensed physical condition.

As a specific example, the variance determining module 104-1 a receivesa digital signal of 1001 0110 (150 in decimal) that is representative ofa sensed physical condition (e.g., temperature) sensed by a sensor fromthe corresponding drive-sense circuit 28. With 8-bits, there are 2⁸(256) possible signals representing the sensed physical condition.Assume that the units for temperature is Celsius and a digital value of0100 0000 (64 in decimal) represents the known value for 25 degreeCelsius. The variance determining module 104-b 1 determines thedifference between the digital signal representing the sensed value(e.g., 1001 0110, 150 in decimal) and the known signal value of (e.g.,0100 0000, 64 in decimal), which is 0011 0000 (86 in decimal). Thevariance determining module 104-b 1 then determines the sensed valuebased on the difference and the known value. In this example, the sensedvalue equals 25+86*(100/256)=25+33.6=58.6 degrees Celsius.

FIG. 6 is a schematic block diagram of a drive center circuit 28-acoupled to a sensor 30. The drive sense-sense circuit 28 includes apower source circuit 110 and a power signal change detection circuit112. The sensor 30 includes one or more transducers that have varyingelectrical characteristics (e.g., capacitance, inductance, impedance,current, voltage, etc.) based on varying physical conditions 114 (e.g.,pressure, temperature, biological, chemical, etc.), or vice versa (e.g.,an actuator).

The power source circuit 110 is operably coupled to the sensor 30 and,when enabled (e.g., from a control signal from the processing module 42,power is applied, a switch is closed, a reference signal is received,etc.) provides a power signal 116 to the sensor 30. The power sourcecircuit 110 may be a voltage supply circuit (e.g., a battery, a linearregulator, an unregulated DC-to-DC converter, etc.) to produce avoltage-based power signal, a current supply circuit (e.g., a currentsource circuit, a current mirror circuit, etc.) to produce acurrent-based power signal, or a circuit that provide a desired powerlevel to the sensor and substantially matches impedance of the sensor.The power source circuit 110 generates the power signal 116 to include aDC (direct current) component and/or an oscillating component.

When receiving the power signal 116 and when exposed to a condition 114,an electrical characteristic of the sensor affects 118 the power signal.When the power signal change detection circuit 112 is enabled, itdetects the affect 118 on the power signal as a result of the electricalcharacteristic of the sensor. For example, the power signal is a 1.5voltage signal and, under a first condition, the sensor draws 1 milliampof current, which corresponds to an impedance of 1.5 K Ohms. Under asecond conditions, the power signal remains at 1.5 volts and the currentincreases to 1.5 milliamps. As such, from condition 1 to condition 2,the impedance of the sensor changed from 1.5 K Ohms to 1 K Ohms. Thepower signal change detection circuit 112 determines this change andgenerates a representative signal 120 of the change to the power signal.

As another example, the power signal is a 1.5 voltage signal and, undera first condition, the sensor draws 1 milliamp of current, whichcorresponds to an impedance of 1.5 K Ohms. Under a second conditions,the power signal drops to 1.3 volts and the current increases to 1.3milliamps. As such, from condition 1 to condition 2, the impedance ofthe sensor changed from 1.5 K Ohms to 1 K Ohms. The power signal changedetection circuit 112 determines this change and generates arepresentative signal 120 of the change to the power signal.

The power signal 116 includes a DC component 122 and/or an oscillatingcomponent 124 as shown in FIG. 7 . The oscillating component 124includes a sinusoidal signal, a square wave signal, a triangular wavesignal, a multiple level signal (e.g., has varying magnitude over timewith respect to the DC component), and/or a polygonal signal (e.g., hasa symmetrical or asymmetrical polygonal shape with respect to the DCcomponent). Note that the power signal is shown without affect from thesensor as the result of a condition or changing condition.

In an embodiment, power generating circuit 110 varies frequency of theoscillating component 124 of the power signal 116 so that it can betuned to the impedance of the sensor and/or to be off-set in frequencyfrom other power signals in a system. For example, a capacitancesensor's impedance decreases with frequency. As such, if the frequencyof the oscillating component is too high with respect to thecapacitance, the capacitor looks like a short and variances incapacitances will be missed. Similarly, if the frequency of theoscillating component is too low with respect to the capacitance, thecapacitor looks like an open and variances in capacitances will bemissed.

In an embodiment, the power generating circuit 110 varies magnitude ofthe DC component 122 and/or the oscillating component 124 to improveresolution of sensing and/or to adjust power consumption of sensing. Inaddition, the power generating circuit 110 generates the drive signal110 such that the magnitude of the oscillating component 124 is lessthan magnitude of the DC component 122.

FIG. 6A is a schematic block diagram of a drive center circuit 28-alcoupled to a sensor 30. The drive sense-sense circuit 28-al includes asignal source circuit 111, a signal change detection circuit 113, and apower source 115. The power source 115 (e.g., a battery, a power supply,a current source, etc.) generates a voltage and/or current that iscombined with a signal 117, which is produced by the signal sourcecircuit 111. The combined signal is supplied to the sensor 30.

The signal source circuit 111 may be a voltage supply circuit (e.g., abattery, a linear regulator, an unregulated DC-to-DC converter, etc.) toproduce a voltage-based signal 117, a current supply circuit (e.g., acurrent source circuit, a current mirror circuit, etc.) to produce acurrent-based signal 117, or a circuit that provide a desired powerlevel to the sensor and substantially matches impedance of the sensor.The signal source circuit 111 generates the signal 117 to include a DC(direct current) component and/or an oscillating component.

When receiving the combined signal (e.g., signal 117 and power from thepower source) and when exposed to a condition 114, an electricalcharacteristic of the sensor affects 119 the signal. When the signalchange detection circuit 113 is enabled, it detects the affect 119 onthe signal as a result of the electrical characteristic of the sensor.

FIG. 8 is an example of a sensor graph that plots an electricalcharacteristic versus a condition. The sensor has a substantially linearregion in which an incremental change in a condition produces acorresponding incremental change in the electrical characteristic. Thegraph shows two types of electrical characteristics: one that increasesas the condition increases and the other that decreases and thecondition increases. As an example of the first type, impedance of atemperature sensor increases and the temperature increases. As anexample of a second type, a capacitance touch sensor decreases incapacitance as a touch is sensed.

FIG. 9 is a schematic block diagram of another example of a power signalgraph in which the electrical characteristic or change in electricalcharacteristic of the sensor is affecting the power signal. In thisexample, the effect of the electrical characteristic or change inelectrical characteristic of the sensor reduced the DC component but hadlittle to no effect on the oscillating component. For example, theelectrical characteristic is resistance. In this example, the resistanceor change in resistance of the sensor decreased the power signal,inferring an increase in resistance for a relatively constant current.

FIG. 10 is a schematic block diagram of another example of a powersignal graph in which the electrical characteristic or change inelectrical characteristic of the sensor is affecting the power signal.In this example, the effect of the electrical characteristic or changein electrical characteristic of the sensor reduced magnitude of theoscillating component but had little to no effect on the DC component.For example, the electrical characteristic is impedance of a capacitorand/or an inductor. In this example, the impedance or change inimpedance of the sensor decreased the magnitude of the oscillatingsignal component, inferring an increase in impedance for a relativelyconstant current.

FIG. 11 is a schematic block diagram of another example of a powersignal graph in which the electrical characteristic or change inelectrical characteristic of the sensor is affecting the power signal.In this example, the effect of the electrical characteristic or changein electrical characteristic of the sensor shifted frequency of theoscillating component but had little to no effect on the DC component.For example, the electrical characteristic is reactance of a capacitorand/or an inductor. In this example, the reactance or change inreactance of the sensor shifted frequency of the oscillating signalcomponent, inferring an increase in reactance (e.g., sensor isfunctioning as an integrator or phase shift circuit).

FIG. 11A is a schematic block diagram of another example of a powersignal graph in which the electrical characteristic or change inelectrical characteristic of the sensor is affecting the power signal.In this example, the effect of the electrical characteristic or changein electrical characteristic of the sensor changes the frequency of theoscillating component but had little to no effect on the DC component.For example, the sensor includes two transducers that oscillate atdifferent frequencies. The first transducer receives the power signal ata frequency of f₁ and converts it into a first physical condition. Thesecond transducer is stimulated by the first physical condition tocreate an electrical signal at a different frequency f₂. In thisexample, the first and second transducers of the sensor change thefrequency of the oscillating signal component, which allows for moregranular sensing and/or a broader range of sensing.

FIG. 12 is a schematic block diagram of an embodiment of a power signalchange detection circuit 112 receiving the affected power signal 118 andthe power signal 116 as generated to produce, therefrom, the signalrepresentative 120 of the power signal change. The affect 118 on thepower signal is the result of an electrical characteristic and/or changein the electrical characteristic of a sensor; a few examples of theaffects are shown in FIGS. 8-11A.

In an embodiment, the power signal change detection circuit 112 detect achange in the DC component 122 and/or the oscillating component 124 ofthe power signal 116. The power signal change detection circuit 112 thengenerates the signal representative 120 of the change to the powersignal based on the change to the power signal. For example, the changeto the power signal results from the impedance of the sensor and/or achange in impedance of the sensor. The representative signal 120 isreflective of the change in the power signal and/or in the change in thesensor's impedance.

In an embodiment, the power signal change detection circuit 112 isoperable to detect a change to the oscillating component at a frequency,which may be a phase shift, frequency change, and/or change in magnitudeof the oscillating component. The power signal change detection circuit112 is also operable to generate the signal representative of the changeto the power signal based on the change to the oscillating component atthe frequency. The power signal change detection circuit 112 is furtheroperable to provide feedback to the power source circuit 110 regardingthe oscillating component. The feedback allows the power source circuit110 to regulate the oscillating component at the desired frequency,phase, and/or magnitude.

FIG. 13 is a schematic block diagram of another embodiment of a drivesense circuit 28-b includes a change detection circuit 150, a regulationcircuit 152, and a power source circuit 154. The drive-sense circuit28-b is coupled to the sensor 30, which includes a transducer that hasvarying electrical characteristics (e.g., capacitance, inductance,impedance, current, voltage, etc.) based on varying physical conditions114 (e.g., pressure, temperature, biological, chemical, etc.).

The power source circuit 154 is operably coupled to the sensor 30 and,when enabled (e.g., from a control signal from the processing module 42,power is applied, a switch is closed, a reference signal is received,etc.) provides a power signal 158 to the sensor 30. The power sourcecircuit 154 may be a voltage supply circuit (e.g., a battery, a linearregulator, an unregulated DC-to-DC converter, etc.) to produce avoltage-based power signal or a current supply circuit (e.g., a currentsource circuit, a current mirror circuit, etc.) to produce acurrent-based power signal. The power source circuit 154 generates thepower signal 158 to include a DC (direct current) component and anoscillating component.

When receiving the power signal 158 and when exposed to a condition 114,an electrical characteristic of the sensor affects 160 the power signal.When the change detection circuit 150 is enabled, it detects the affect160 on the power signal as a result of the electrical characteristic ofthe sensor 30. The change detection circuit 150 is further operable togenerate a signal 120 that is representative of change to the powersignal based on the detected effect on the power signal.

The regulation circuit 152, when its enabled, generates regulationsignal 156 to regulate the DC component to a desired DC level and/orregulate the oscillating component to a desired oscillating level (e.g.,magnitude, phase, and/or frequency) based on the signal 120 that isrepresentative of the change to the power signal. The power sourcecircuit 154 utilizes the regulation signal 156 to keep the power signalat a desired setting 158 regardless of the electrical characteristic ofthe sensor. In this manner, the amount of regulation is indicative ofthe affect the electrical characteristic had on the power signal.

In an example, the power source circuit 158 is a DC-DC converteroperable to provide a regulated power signal having DC and ACcomponents. The change detection circuit 150 is a comparator and theregulation circuit 152 is a pulse width modulator to produce theregulation signal 156. The comparator compares the power signal 158,which is affected by the sensor, with a reference signal that includesDC and AC components. When the electrical characteristics is at a firstlevel (e.g., a first impedance), the power signal is regulated toprovide a voltage and current such that the power signal substantiallyresembles the reference signal.

When the electrical characteristics changes to a second level (e.g., asecond impedance), the change detection circuit 150 detects a change inthe DC and/or AC component of the power signal 158 and generates therepresentative signal 120, which indicates the changes. The regulationcircuit 152 detects the change in the representative signal 120 andcreates the regulation signal to substantially remove the effect on thepower signal. The regulation of the power signal 158 may be done byregulating the magnitude of the DC and/or AC components, by adjustingthe frequency of AC component, and/or by adjusting the phase of the ACcomponent.

With respect to the operation of various drive-sense circuits asdescribed herein and/or their equivalents, note that the operation ofsuch a drive-sense circuit is operable simultaneously to drive and sensea signal via a single line. In comparison to switched, time-divided,time-multiplexed, etc. operation in which there is switching betweendriving and sensing (e.g., driving at first time, sensing at secondtime, etc.) of different respective signals at separate and distincttimes, the drive-sense circuit is operable simultaneously to performboth driving and sensing of a signal. In some examples, suchsimultaneous driving and sensing is performed via a single line using adrive-sense circuit.

In addition, other alternative implementations of various drive-sensecircuits are described in U.S. Utility patent application Ser. No.16/113,379, entitled “DRIVE SENSE CIRCUIT WITH DRIVE-SENSE LINE,”, filedAug. 27, 2018, pending. Any instantiation of a drive-sense circuit asdescribed herein may be implemented using any of the variousimplementations of various drive-sense circuits described in U.S.Utility patent application Ser. No. 16/113,379.

In addition, note that the one or more signals provided from adrive-sense circuit (DSC) may be of any of a variety of types. Forexample, such a signal may be based on encoding of one or more bits togenerate one or more coded bits used to generate modulation data (orgenerally, data). For example, a device is configured to perform forwarderror correction (FEC) and/or error checking and correction (ECC) codeof one or more bits to generate one or more coded bits. Examples of FECand/or ECC may include turbo code, convolutional code, turbo trelliscoded modulation (TTCM), low density parity check (LDPC) code,Reed-Solomon (RS) code, BCH (Bose and Ray-Chaudhuri, and Hocquenghem)code, binary convolutional code (BCC), Cyclic Redundancy Check (CRC),and/or any other type of ECC and/or FEC code and/or combination thereof,etc. Note that more than one type of ECC and/or FEC code may be used inany of various implementations including concatenation (e.g., first ECCand/or FEC code followed by second ECC and/or FEC code, etc. such asbased on an inner code/outer code architecture, etc.), parallelarchitecture (e.g., such that first ECC and/or FEC code operates onfirst bits while second ECC and/or FEC code operates on second bits,etc.), and/or any combination thereof.

Also, the one or more coded bits may then undergo modulation or symbolmapping to generate modulation symbols (e.g., the modulation symbols mayinclude data intended for one or more recipient devices, components,elements, etc.). Note that such modulation symbols may be generatedusing any of various types of modulation coding techniques. Examples ofsuch modulation coding techniques may include binary phase shift keying(BPSK), quadrature phase shift keying (QPSK), 8-phase shift keying(PSK), 16 quadrature amplitude modulation (QAM), 32 amplitude and phaseshift keying (APSK), etc., uncoded modulation, and/or any other desiredtypes of modulation including higher ordered modulations that mayinclude even greater number of constellation points (e.g., 1024 QAM,etc.).

In addition, note a signal provided from a DSC may be of a uniquefrequency that is different from signals provided from other DSCs. Also,a signal provided from a DSC may include multiple frequenciesindependently or simultaneously. The frequency of the signal can behopped on a pre-arranged pattern. In some examples, a handshake isestablished between one or more DSCs and one or more processing module(e.g., one or more controllers) such that the one or more DSC is/aredirected by the one or more processing modules regarding which frequencyor frequencies and/or which other one or more characteristics of the oneor more signals to use at one or more respective times and/or in one ormore particular situations.

FIG. 14 is a schematic block diagram of an embodiment 1400 of acomputing device operative with an e-pen (an electronic or electricalpen with electrical and/or electronic functionality) in accordance withthe present invention. Within this diagram as well as any other diagramdescribed herein, or their equivalents, the one or more touch sensors1410 (e.g., touch sensor electrodes) may be of any of a variety of oneor more types including any one or more of a touchscreen, a button, anelectrode, an external controller, rows of electrodes, columns ofelectrodes, a matrix of buttons, an array of buttons, a film thatincludes any desired implementation of components to facilitate touchsensor operation, and/or any other configuration by which interactionwith the touch sensor may be performed. Note that the one or more touchsensors 1410 may be implemented within any of a variety of devicesincluding any one or more of touchscreen, pad device, laptop, cellphone, smartphone, whiteboard, interactive display, navigation systemdisplay, in vehicle display, etc., and/or any other device in which oneor more touch sensors 1410 may be implemented.

Note that such interaction of a user with a touch sensor may correspondto the user touching the touch sensor, the user being in proximatedistance to the touch sensor (e.g., within a sufficient proximity to thetouch sensor that coupling from the user to the touch sensor may beperformed via capacitively coupling (CC), etc. and/or generally anymanner of interacting with the touch sensor that is detectable based onprocessing of signals transmitted to and/or sensed from the touchsensor). With respect to the various embodiments, implementations, etc.of various respective touch sensors as described herein, note that theymay also be of any such variety of one or more types. For example, touchsensors may be implemented or include any one or more of touch sensorelectrodes, capacitive buttons, capacitive sensors, row and columnimplementations of touch sensor electrodes such as in a touchscreen,etc.

One example of such user interaction with the one or more touch sensors1410 is via capacitive coupling to a touch sensor. Such capacitivecoupling may be achieved from a user, via a stylus, an active elementsuch as an electronic pen (e-pen), and/or any other element implementedto perform capacitive coupling to the touch sensor. In some examples,note that the one or more touch sensors 1410 are also implemented todetect user interaction based on user touch (e.g., via capacitivecoupling (CC) from a user, such as a user's finger, to the one or moretouch sensors 1410).

At the top of the diagram, a user interacts with one or more touchsensors 1410 using one or more electronic pens (e-pens). An e-pen 1402is configured to transmit one or more signals that is/are detected bythe one or more touch sensors 1410. When different respective signalsare transmitted from the different respective sensor electrodes of ane-pen, the one or more touch sensors 1410 is implemented to detect thesignals and distinguish among them. For example, the one or more touchsensors 1410 is configured to detect, process, and identify thedifferent respective signals provided from the different respectivesensor electrodes of the e-pen 1402.

At the bottom of the diagram, one or more processing modules 1430 iscoupled to drive-sense circuits (DSCs) 28. Note that the one or moreprocessing modules 1430 may include integrated memory and/or be coupledto other memory. At least some of the memory stores operationalinstructions to be executed by the one or more processing modules 1430.In some examples, the one or more processing modules 1430 includes afirst subset of the one or more processing modules 1430 that are incommunication and operative with a first subset of the DSCs 28 (e.g.,those in communication with the e-pen sensor electrodes) and a secondsubset of the one or more processing modules 1430 that are incommunication and operative with a second subset of the DSCs 28 (e.g.,those in communication with the one or more touch sensors 1410).

In some examples, these two different subsets of the one or moreprocessing modules 1430 are also in communication with one another(e.g., via communication effectuated via the e-pen sensor electrodes andthe one or more touch sensors 1410 themselves, via one or morealternative communication means such as a backplane, a bus, a wirelesscommunication path, etc., and/or other means). In some particularexamples, these two different subsets of the one or more processingmodules 1430 are not in communication with one another directly otherthan via the signal coupling between the e-pen sensor electrodes and theone or more touch sensors 1410 themselves.

In addition, in certain examples, note that the detection and sensingcapability of a DSC as described herein is such that detection ofsignals being coupled from the e-pen sensor electrodes to the one ormore touch sensors 1410, and vice versa, may be effectuated without thee-pen 1402 (e.g., a writing and/or erasing tip of the e-pen 1402) beingin contact with a touchscreen associated with the one or more touchsensors 1410. For example, as the e-pen 1402 is above (e.g., hoveringover) or within sufficient proximity for signal coupling between thee-pen sensor electrodes to the one or more touch sensors 1410, and viceversa, then detection and sensing of such signals may be made.

A first group of one or more DSCs 28 is/are implemented simultaneouslyto drive and to sense respective one or more signals provided to the oneor more touch sensors 1410. In addition, a second group of one or moreDSCs 28 is/are implemented simultaneously to drive and to senserespective one or more other signals provided to the respective sensorelectrodes of the e-pen 1402.

For example, a first DSC 28 is implemented simultaneously to drive andto sense a first signal via a first sensor electrode (e.g., a primarysensor electrode) of the e-pen 1402. A second DSC 28 is implementedsimultaneously to drive and to sense a second signal via a second sensorelectrode (e.g., a first secondary sensor electrode) of the e-pen 1402.Note that any number of additional DSCs implemented simultaneously todrive and to sense additional signals to additional sensor electrodes ofthe e-pen 1402 as may be appropriate in certain embodiments. Note alsothat the respective DSCs 28 may be implemented in a variety of ways. Forexample, they may be implemented within a device that includes the oneor more touch sensors 1410, they may be implemented within the e-pen1402, they may be distributed among the device that includes the one ormore touch sensors 1410 and the e-pen 1402, etc.

In an example of operation and implementation, the one or moreprocessing modules 1430 is configured to generate a first signal. Afirst DSC 28 is configured simultaneously to drive and to sense thefirst signal via a first sensor electrode. In some examples, the one ormore processing modules 1430 is configured to generate a number of othersignals such as a second signal, third signal, fourth signal, etc. Ingeneral, the one or more processing modules 1430 is configured togenerate any one or more signals to be provided via one or more DSCs 28.In this example of operation and implementation, the one or moreprocessing modules 1430 is also configured to generate a second signal.A second DSC 28 is configured simultaneously to drive and to sense thesecond signal via a second sensor electrode. As may be appropriate incertain embodiments, the one or more processing modules 1430 is alsoconfigured to generate additional signals up to an nth signal (e.g.,where n is a positive integer greater than or equal to 3). An nth DSC 28is configured simultaneously to drive and to sense the nth signal via anth sensor electrode.

Note that the different respective signals provided via the differentDSCs 28 are differentiated in frequency. For example, if first signalhas a first frequency, and a second signal has a second frequency thatis different than the first frequency. When implemented, a third signalhas a third frequency that is different than the first frequency and thesecond frequency. In general, any number of different respective signalsgenerated by the one or more processing modules 1430 are differentiatedin frequency.

In addition, note that different respective signals having differentrespective frequencies are provided from the DSCs 28 that are associatedwith the one or more touch sensors 1410 (e.g., on the lower right-handportion of the diagram). Each of those respective DSCs 28 is alsoconfigured simultaneously to drive and to sense its respective signal.

Note that the signals that are provided via the different respectivesensor electrodes are coupled into one or more of the touch sensors 1410when the e-pen 1402 is interacting with the device that includes the oneor more touch sensors 1410. For example, when the e-pen 1402 is withinsufficient proximity to the one or more touch sensors 1410 and such thatthe respective DSCs 28 that are associated with the one or more touchsensors 1410 and that are configured simultaneously to drive and tosense their respective signals detect one or more of the signals thatare provided via the different respective sensor electrodes are coupledinto one or more of the touch sensors 1410, then the signals that areprovided from the different respective sensor electrodes of the e-pen1402 will be coupled into and detected by the DSCs 28 that areassociated with the one or more touch sensors 1410. The one or moreprocessing modules 1430 is configured to process signals provided fromthe various DSCs 28 to determine various information regarding the e-pen1402. Such information includes the location of the e-pen 1402 withrespect to the one or more touch sensors 1410, the orientation of thee-pen 1402 with respect to the one or more touch sensors 1410, which oneor more signals coupled from the one or more sensor electrodes of thee-pen 1402 are being coupled into the one or more touch sensors 1410,etc.

In some examples, note that the converse operation is also performed.Those signals that are driven and simultaneously sensed by the DSCs 28via the one or more touch sensors 1410 may also be detected, process,and identified by the DSCs 28 that simultaneously drive and sense theirrespective signals via the e-pen sensor electrodes 1-n. For example, asignal that is driven by a DSC 28 via one of the touch sensors 1510 mayalso be coupled into and detected by one or more of the DSCs 28 thatsimultaneously drive and sense their respective signals via the e-pensensor electrodes 1-n.

The coupling of signals between the various e-pen sensor electrodes andthe one or more touch sensors 1410 is performed bidirectionally in someimplementations. Note that detection, processing, identification, etc.may be performed by the one or more processing modules 1430 based onlyon signals associated with the DSCs 28 that are coupled to the e-pensensor electrodes, based only on signals associated with the DSCs 28that are coupled to the one or more touch sensors 1410, and/or based onboth signals associated with the DSCs 28 that are coupled to the e-pensensor electrodes and also to the one or more touch sensors 1410.

In addition, note that certain examples, embodiments, etc. areimplemented such that a DSC is operative to perform both drive and senseof a signal (e.g., transmit and detect) simultaneously. However, as maybe desired in certain applications, a DSC may be implemented only toperform drive (e.g., transmit) of a signal. In an example of operationand implementation, no generation of a digital signal that isrepresentative of an electrical characteristic of an element (e.g.,sensor electrode, sensor, transducer, etc.) is made.

In certain examples that include more than one DSC, a first DSC isimplemented to perform both drive and sense of a first signal (e.g.,transmit and detect) simultaneously, and a second DSC is implemented toperform only drive (e.g., transmit) of a second signal. Any desiredcombination of DSCs may be implemented such that one or more DSCs areconfigured to perform both drive and sense of signals (e.g., transmitand detect) simultaneously as one or more other DSCs are configured toperform only drive (e.g., transmit) of other signals.

With respect to any signal that is driven and simultaneously detected bya DSC 28, note that any additional signal that is coupled into thesensor electrode or touch sensor associated with that DSC 28 is alsodetectable. For example, a DSC 28 that is associated with a touch sensorwill detect any signal from one or more of the e-pen sensor electrodesthat gets coupled into that touch sensor. Similarly, a DSC 28 that isassociated with an e-pen sensor electrode will detect any signal fromone or more of the touch sensors 1410 that gets coupled into that e-pensensor electrode.

Note that the different respective signals that are driven andsimultaneously sensed via the respective e-pen sensor electrodes on theone or more sensors 1410 are differentiated from one another.Appropriate filtering and processing can identify the various signalsgiven their differentiation, orthogonality to one another, difference infrequency, etc. Other examples described herein and their equivalentsoperate using any of a number of different characteristics other than orin addition to frequency.

In an example of operation and implementation, the e-pen 1402 includes aplurality of e-pen sensor electrodes including a first e-pen sensorelectrode and a second e-pen sensor electrode and a plurality ofdrive-sense circuits (DSCs), including a first DSC and a second DSC,operably coupled to the plurality of e-pen sensor electrodes. The firstDSC, when enabled, is configured to drive a first e-pen signal having afirst frequency via a first single line coupling to the first e-pensensor electrode and simultaneously sense, via the first single line,the first e-pen signal, wherein based on interaction of the e-pen with atouch sensor device, the first e-pen signal is coupled into at least onetouch sensor electrode of the touch sensor device. Also, the first DSC,when enabled, is configured to process the first e-pen signal togenerate a first digital signal that is representative of a firstelectrical characteristic of the first e-pen sensor electrode.

The second DSC, when enabled, is configured to drive a second e-pensignal having a second frequency that is different than the firstfrequency via a second single line coupling to the second e-pen sensorelectrode and simultaneously sense, via the second single line, thesecond e-pen signal, wherein based on the interaction of the e-pen withthe touch sensor device, the second e-pen signal is coupled into the atleast one touch sensor electrode. Also, the second DSC, when enabled, isconfigured to process the second e-pen signal to generate a seconddigital signal that is representative of a second electricalcharacteristic of the second e-pen sensor electrode.

In some examples, the e-pen 1402 also includes memory that storesoperational instructions, and a processing module operably coupled tothe first DSC and the second DSC and to the memory. The processingmodule when enabled, is configured to execute the operationalinstructions to process at least one of the first digital signal or thesecond digital signal to detect the interaction of the e-pen with thetouch sensor device.

In other examples, the touch sensor device also includes a third DSCoperably coupled to a first touch sensor electrode of the at least onetouch sensor electrode. The third DSC, when enabled, is configured todrive a touch sensor signal having a third frequency via a third singleline coupling to the first touch sensor electrode and simultaneouslysense, via the third single line, the touch sensor signal, wherein basedon the interaction of the e-pen with the touch sensor device, sensingthe touch sensor signal includes sensing at least one of the first e-pensignal that is coupled from the first e-pen sensor electrode into thefirst touch sensor electrode or the second e-pen signal that is coupledfrom the second e-pen sensor electrode into the first touch sensorelectrode. Also, the third DSC, when enabled, is configured to processthe touch sensor signal to generate a third digital signal that isrepresentative of a third electrical characteristic of the first touchsensor electrode.

In addition, in certain examples, the touch sensor device also includesmemory that stores operational instructions, and a processing moduleoperably coupled to the third DSC and to the memory. The processingmodule when enabled, is configured to execute the operationalinstructions to process the third digital signal to determine locationof at least one of the first e-pen sensor electrode or the second e-pensensor electrode based on the interaction of the e-pen with the touchsensor device.

In yet other examples, the touch sensor device also includes anotherplurality of DSCs, including a third DSC and a fourth DSC, operablycoupled to a plurality of touch sensor electrodes, including a firsttouch sensor electrode and a second touch sensor electrode, includingthe at least one touch sensor electrode.

The third DSC, when enabled, is configured to drive a first touch sensorsignal having a third frequency via a third single line coupling to thefirst touch sensor electrode and simultaneously sense, via the thirdsingle line, the first touch sensor signal, wherein based on theinteraction of the e-pen with the touch sensor device, sensing the firsttouch sensor signal includes sensing at least one of the first e-pensignal that is coupled from the first e-pen sensor electrode into thefirst touch sensor electrode or the second e-pen signal that is coupledfrom the second e-pen sensor electrode into the second touch sensorelectrode. Also, the third DSC, when enabled, is configured to processthe first touch sensor signal to generate a third digital signal that isrepresentative of a third electrical characteristic of the first touchsensor electrode.

The second DSC, when enabled, configured to drive a second touch sensorsignal having a fourth frequency that is different than the firstfrequency via a fourth single line coupling to the second touch sensorelectrode and simultaneously sense, via the fourth single line, thesecond touch sensor signal, wherein based on the interaction of thee-pen with the touch sensor device, sensing the second touch sensorsignal includes sensing at least one of the first e-pen signal that iscoupled from the first e-pen sensor electrode into the first touchsensor electrode or the second e-pen signal that is coupled from thesecond e-pen sensor electrode into the second touch sensor electrode.Also, the fourth DSC, when enabled, is configured to process the secondtouch sensor signal to generate a fourth digital signal that isrepresentative of a fourth electrical characteristic of the second touchsensor electrode.

In even other examples, the touch sensor device also includes memorythat stores operational instructions, and a processing module operablycoupled to the third DSC, the fourth DSC, and to the memory. Theprocessing module when enabled, is configured to execute the operationalinstructions to process the third digital signal and the fourth digitalsignal to determine location of at least one of the first e-pen sensorelectrode or the second e-pen sensor electrode based on the interactionof the e-pen with the touch sensor device and also based on atwo-dimensional mapping of a touchscreen of the touch sensor device thatuniquely identifies an intersection of the first touch sensor electrodeand the second touch sensor electrode.

Also, in some particular examples, the first DSC also includes a powersource circuit operably coupled to the first e-pen sensor electrode viathe first single line. When enabled, the power source circuit isconfigured to provide the first e-pen signal that includes an analogsignal via the first single line coupling to the first e-pen sensorelectrode, and wherein the analog signal includes at least one of a DC(direct current) component or an oscillating component. Also, the firstDSC includes a power source change detection circuit operably coupled tothe power source circuit. When enabled, the power source changedetection circuit is configured to detect an effect on the analog signalthat is based on the first electrical characteristic of the first e-pensensor electrode, and to generate the first digital signal that isrepresentative of the first electrical characteristic of the first e-pensensor electrode.

In certain additional examples, the power source circuit includes apower source to source at least one of a voltage or a current to thefirst e-pen sensor electrode via the first single line. Also, the powersource change detection circuit includes a power source referencecircuit configured to provide at least one of a voltage reference or acurrent reference, and a comparator configured to compare the at leastone of the voltage and the current provided to the first e-pen sensorelectrode to the at least one of the voltage reference and the currentreference to produce the analog signal.

In various examples, embodiments, etc., note that one or more processingmodules are in communication with one or more of DSCs, touch sensorelectrodes, e-pen sensor electrodes, etc. and are configured to performprocessing of the various signals associated with them for variouspurposes.

FIG. 15 is a schematic block diagram of another embodiment 1500 of acomputing device operative with an e-pen in accordance with the presentinvention. This diagram has some similarities to the previous diagramwith at least one difference being that the respective e-pen and touchsensor signals are differentiated by one or more characteristics thatmay include any one or more of frequency, amplitude, DC offset,modulation, modulation & coding set/rate (MCS), forward error correction(FEC) and/or error checking and correction (ECC), type, etc.

Within this diagram as well as any other diagram described herein, ortheir equivalents, the one or more touch sensors 1510 may be of any of avariety of one or more types including any one or more of a touchscreen,a button, an electrode, an external controller, rows of electrodes,columns of electrodes, a matrix of buttons, an array of buttons, a filmthat includes any desired implementation of components to facilitatetouch sensor operation, and/or any other configuration by whichinteraction with the touch sensor may be performed. Note that the one ormore touch sensors 1510 may be implemented within any of a variety ofdevices including any one or more of touchscreen, pad device, laptop,cell phone, smartphone, whiteboard, interactive display, navigationsystem display, in vehicle display, etc., and/or any other device inwhich one or more touch sensors 1510 may be implemented.

Note that such interaction of a user with a touch sensor may correspondto the user touching the touch sensor, the user being in proximatedistance to the touch sensor (e.g., within a sufficient proximity to thetouch sensor that coupling from the user to the touch sensor may beperformed via capacitively coupling (CC), etc. and/or generally anymanner of interacting with the touch sensor that is detectable based onprocessing of signals transmitted to and/or sensed from the touchsensor). With respect to the various embodiments, implementations, etc.of various respective touch sensors as described herein, note that theymay also be of any such variety of one or more types.

One example of such user interaction with the one or more touch sensors1510 is via capacitive coupling to a touch sensor. Such capacitivecoupling may be achieved from a user, via a stylus, an active elementsuch as an electronic pen (e-pen), and/or any other element implementedto perform capacitive coupling to the touch sensor. In some examples,note that the one or more touch sensors 1510 are also implemented todetect user interaction based on user touch (e.g., via capacitivecoupling (CC) from a user, such as a user's finger, to the one or moretouch sensors 1510).

At the top of the diagram, a user interacts with one or more touchsensors 1510 using one or more electronic pens (e-pens). An e-pen 1502is configured to transmit one or more signals that is/are detected bythe one or more touch sensors 1510. When different respective signalsare transmitted from the different respective sensor electrodes of ane-pen 1502, the one or more touch sensors 1510 is implemented to detectthe signals and distinguish among them. For example, the one or moretouch sensors 1510 is configured to detect, process, and identify thedifferent respective signals provided from the different respectivesensor electrodes of the e-pen 1502.

At the bottom of the diagram, one or more processing modules 1530 iscoupled to drive-sense circuits (DSCs) 28. Note that the one or moreprocessing modules 1530 may include integrated memory and/or be coupledto other memory. At least some of the memory stores operationalinstructions to be executed by the one or more processing modules 1530.

Note that the differentiation among the different respective signalsthat are driven and simultaneously sensed by the various DSCs 28 may bedifferentiated based on any one or more characteristics such asfrequency, amplitude, modulation, modulation & coding set/rate (MCS),forward error correction (FEC) and/or error checking and correction(ECC), type, etc.

By appropriate processing by the one or more processing modules 1530,the one or more processing modules 1530 is configured, based on, todetect, process, and identify, which signal is being detected based onthese one or more characteristics.

Differentiation between the signals based on frequency corresponds to afirst signal has a first frequency and a second signal has a secondfrequency different than the first frequency. Differentiation betweenthe signals based on amplitude corresponds to a that if first signal hasa first amplitude and a second signal has a second amplitude differentthan the first amplitude. Note that the amplitude may be a fixedamplitude for a DC signal or the oscillating amplitude component for asignal having both a DC offset and an oscillating component.Differentiation between the signals based on DC offset corresponds to athat if first signal has a first DC offset and a second signal has asecond DC offset different than the first DC offset.

Differentiation between the signals based on modulation and/ormodulation & coding set/rate (MCS) corresponds to a first signal has afirst modulation and/or MCS and a second signal has a second modulationand/or MCS different than the first modulation and/or MCS. Examples ofmodulation and/or MCS may include binary phase shift keying (BPSK),quadrature phase shift keying (QPSK) or quadrature amplitude modulation(QAM), 8-phase shift keying (PSK), 16 quadrature amplitude modulation(QAM), 32 amplitude and phase shift keying (APSK), 64-QAM, etc., uncodedmodulation, and/or any other desired types of modulation includinghigher ordered modulations that may include even greater number ofconstellation points (e.g., 1024 QAM, etc.). For example, a first signalmay be of a QAM modulation, and the second signal may be of a 32 APSKmodulation. In an alternative example, a first signal may be of a firstQAM modulation such that the constellation points there and have a firstlabeling/mapping, and the second signal may be of a second QAMmodulation such that the constellation points there and have a secondlabeling/mapping.

Differentiation between the signals based on FEC/ECC corresponds to afirst signal being generated, coded, and/or based on a first FEC/ECC anda second signal being generated, coded, and/or based on a second FEC/ECCthat is different than the first modulation and/or first FEC/ECC.Examples of FEC and/or ECC may include turbo code, convolutional code,turbo trellis coded modulation (TTCM), low density parity check (LDPC)code, Reed-Solomon (RS) code, BCH (Bose and Ray-Chaudhuri, andHocquenghem) code, binary convolutional code (BCC), Cyclic RedundancyCheck (CRC), and/or any other type of ECC and/or FEC code and/orcombination thereof, etc. Note that more than one type of ECC and/or FECcode may be used in any of various implementations includingconcatenation (e.g., first ECC and/or FEC code followed by second ECCand/or FEC code, etc. such as based on an inner code/outer codearchitecture, etc.), parallel architecture (e.g., such that first ECCand/or FEC code operates on first bits while second ECC and/or FEC codeoperates on second bits, etc.), and/or any combination thereof. Forexample, a first signal may be generated, coded, and/or based on a firstLDPC code, and the second signal may be generated, coded, and/or basedon a second LDPC code. In an alternative example, a first signal may begenerated, coded, and/or based on a BCH code, and the second signal maybe generated, coded, and/or based on a turbo code. Differentiationbetween the different respective signals may be made based on a similartype of FEC/ECC, using different characteristics of the FEC/ECC (e.g.,codeword length, redundancy, matrix size, etc. as may be appropriatewith respect to the particular type of FEC/ECC). Alternatively,differentiation between the different respective signals may be madebased on using different types of FEC/ECC for the different respectivesignals. In an example, signal #1 includes a first frequency, a firstamplitude, a first DC offset, a first modulation, a first FEC/ECC, afirst type (e.g., f1, amp. 1, DC off. 1, mod. 1, FEC/ECC 1, type, etc.),and signal #2 includes a second frequency, a second amplitude, a secondDC offset, a second modulation, a second FEC/ECC, a second type (e.g.,f2, amp. 2, DC off. 2, mod. 2, FEC/ECC 2, type, etc.), and so on.Similarly, when additional signals are implemented, signal #n includes asecond frequency, a second amplitude, a second DC offset, a secondmodulation, a second FEC/ECC, a second type (e.g., fn, amp, n, DC off n,mod. n, FEC/ECC n, type, etc.). Generally speaking, the e-pen and touchsensor(s) signals differentiated by one or more characteristics (e.g.,frequency, amplitude, DC offset, modulation, FEC/ECC, type, etc.). Also,signals #a-x include differentiated parameters (e.g., fa, amp. a, DCoff. a, mod. a, FEC/ECC a, type, etc., . . . fx, amp. x, DC off. x, mod.x, FEC/ECC x, type, etc.).

Differentiation between the signals based on type corresponds to a firstsignal being or a first type and a second signal being of a secondgenerated, coded, and/or based on a second type that is different thanthe first type. Examples of different types of signals include asinusoidal signal, a square wave signal, a triangular wave signal, amultiple level signal, a polygonal signal, a DC signal, etc. Forexample, a first signal may be of a sinusoidal signal type, and thesecond signal may be of a DC signal type. In an alternative example, afirst signal may be of a first sinusoidal signal type having firstsinusoidal characteristics (e.g., first frequency, first amplitude,first DC offset, first phase, etc.), and the second signal may be ofsecond sinusoidal signal type having second sinusoidal characteristics(e.g., second frequency, second amplitude, second DC offset, secondphase, etc.) that is different than the first sinusoidal signal type.

Note that any implementation that differentiates the signals based onone or more characteristics may be used in this and other embodiments,examples, and their equivalents.

In an example of operation and implementation, the one or moreprocessing modules 1530 is configured to generate a first signal. Afirst DSC 28 is configured simultaneously to drive and to sense thefirst signal via a first sensor electrode. In some examples, the one ormore processing modules 1530 is configured to generate a number of othersignals such as a second signal, third signal, fourth signal, etc. Ingeneral, the one or more processing modules 1530 is configured togenerate any one or more signals to be provided via one or more DSCs 28.In this example of operation and implementation, the one or moreprocessing modules 1530 is also configured to generate a second signal.A second DSC 28 is configured simultaneously to drive and to sense thesecond signal via a second sensor electrode. As may be appropriate incertain embodiments, the one or more processing modules 1530 is alsoconfigured to generate additional signals up to an nth signal (e.g.,where n is a positive integer greater than or equal to 3). An nth DSC 28is configured simultaneously to drive and to sense the nth signal via anth sensor electrode.

Note that the different respective signals provided via the differentDSCs 28 are differentiated in frequency. For example, if first signalhas a first frequency, and a second signal has a second frequency thatis different than the first frequency. When implemented, a third signalhas a third frequency that is different than the first frequency and thesecond frequency. In general, any number of different respective signalsgenerated by the one or more processing modules 1530 are differentiatedin based on one or more characteristics.

Note that there may be certain implementations where differentiationbetween the signals driven and simultaneously sensed via the e-pensensor electrodes in the one or more touch sensors 1510 may be limitedby design. For example, there may be certain implementations wheredifferentiation is desired based on only one characteristic. Otherlimitations may operate based on differentiation based on two or morecharacteristics (and generally up to n characteristics, where n is apositive integer greater than or equal to 2). Note that there may besome processing latency introduced in some examples when differentiationbetween the respective signals is based on multiple differentparameters. For example, when identifying a particular signal,processing may be performed across a variety of characteristics toensure proper detection of the signal when there is differentiationbetween the respective signals in multiple dimensions.

In addition, note that adaptation between the different respectivecharacteristics may be made. For example, at or during a first time,differentiation may be made based on a first one of the characteristics(e.g., frequency). Then, at or during a second time, differentiation maybe based on a second one of the characteristics (e.g., DC offset). Then,at or during a third time, differentiation may be based on a third oneof the characteristics (e.g., modulation/MCS), and so on.

Various aspects, embodiments, and/or examples of the invention (and/ortheir equivalents) provide for individualization and uniqueness withrespect to the different respective signals that are driven andsimultaneously sensed via the respective DSCs 28. Appropriate detection,processing, and identification based on these one or morecharacteristics allows for differentiation and identification of thedifferent respective signals as well as the e-pen sensor electrodes andthe one or more touch sensors 1510 via which those signals are drivenand simultaneously sensed.

For example, consider an implementation in which a mapping of whichsignals provided via which DSC 28 is known, then detection of aparticular signal also allows for identification of which DSC 28provided that signal. Also, when a mapping of which DSC 28 is connectedto which e-pen sensor electrode or which of the one or more touchsensors 1510 is known, then detection of a particular signal also allowsfor identification of that particular e-pen sensor electrode or aparticular touch sensor of the one or more touch sensors 1510.

Note that the transmission, reception, detection, driving, and sensing,of signals by one or more of the various DSCs 28 allows for detection inboth directions between the e-pen sensor electrodes and the one or moretouch sensors 1510. Various aspects, embodiments, and/or examples of theinvention (and/or their equivalents) are provided herein by which suchdetection, processing, identification, etc. is performed by one or moreprocessing modules associated with an e-pen, associated with one or moretouch sensors (e.g., a device that includes the one or more touchsensors), or cooperatively associated with both the e-pen and the one ormore touch sensors (e.g., a device that includes the one or more touchsensors).

FIG. 16 is a schematic block diagram of embodiments 1600 of computingdevices operative with different types of e-pens in accordance with thepresent invention. Different respective groups of one or more touchsensors 1610, 1620, and 1630 are shown. Note that the respective groupsof one or more touch sensors 1610, 1620, and 1630 may be included withinany of a number of devices as described herein including any one or moreof touchscreen, pad device, laptop, cell phone, smartphone, whiteboard,interactive display, navigation system display, in vehicle display,etc., and/or any other device in which one or more touch sensors 1610,1620, and 1630 may be implemented. For example, the touch sensor(s) maybe implemented in a variety of devices including touchscreen, button(s),pad device, laptop, interactive display, interactive table, etc.

In the upper left-hand portion of the diagram, a tethered e-pen 1612 iselectrically connected to the one or more touch sensors 1610. In thisexample, note that the DSCs are implemented remotely from the tetherede-pen 1612. For example, the electrodes in the tethered e-pen 1612 arecoupled to remotely implemented DSCs, such as may be implemented withina device that includes the one or more touch sensors 1610. For example,the DSCs are remote from the e-pen, and the electrodes in the e-pencoupled to remotely implemented DSCs, such as in element including touchsensor(s) 1610).

In the upper right-hand portion of the diagram, a tethered e-pen 1622 iselectrically connected to the one or more touch sensors 1620. In thisexample, note that the DSCs are implemented within or integrated intothe tethered e-pen 1622. For example, the electrodes in the tetherede-pen 1622 are coupled to locally implemented DSCs within the tetherede-pen 1622. For example, the DSCs in the tethered e-pen 1622 are coupledto a power source within the tethered e-pen 1622. In some examples, thepower source is a battery-powered power source within the tethered e-pen1622. In other examples, the power source is power supply that isenergized remotely from a device that includes the one or more touchsensors 1620. For example, the DSCs are integrated into the e-pen, andthe DSCs in the e-pen are coupled to power source within e-pen (e.g.,battery-powered, powered remotely from device).

In addition, within the respective diagram shown at the top portion ofthe diagram, when a tethering is implemented between a tethered e-penand a device that includes one or more touch sensors, note that the DSCsthat drive the respective electrodes within the e-pen may alternativelybe implemented and distributed between the e-pen itself and the devicethat includes the one or more touch sensors. For example, a first DSCmay be implemented within the device that includes the one or more touchsensors and drives a first signal via the tethering and via a firstelectrode within the tethered e-pen. A second DSC may be locallyimplemented within the e-pen and is configured simultaneously to driveand to sense a second signal via a second electrode within the tetherede-pen.

In the bottom portion of the diagram, a wireless e-pen 1632 iscommunication with the one or more touch sensors 1620. In this example,note that the DSCs are implemented within or integrated into thewireless e-pen 1632. For example, the electrodes in the wireless e-pen1632 are coupled to locally implemented DSCs within the wireless e-pen1632. For example, the DSCs in the wireless e-pen 1632 are coupled to apower source within the wireless e-pen 1632. In some examples, the powersource is a battery-powered power source within the wireless e-pen 1632.For example, the DSCs are integrated into wireless e-pen (e.g., DSCs ine-pen coupled to power source within e-pen, e.g., battery-powered).

This diagram shows various examples by which DSCs may be implementedwithin a device that includes one or more touch sensors, implementedwithin an e-pen that may be of different types including a tetherede-pen, a wireless e-pen, etc., or alternatively be distributed amongboth the device that includes the one or more touch sensors and thee-pen.

FIG. 17A is a schematic block diagram of an embodiment 1701 of an e-penin accordance with the present invention. This diagram includes an e-pen1712 that may optionally include a power source 1718 therein (e.g., suchas to provide power to one or more DSCs coupled to the respective sensorelectrodes). The e-pen 1712 includes multiple respective sensorelectrodes. For example, the e-pen 1712 includes sensor electrodes 0, 1,2, 3, and 4. The sensor electrode 0 may be viewed as being a centersensor electrode 0, a primary sensor electrode 0, implemented within apivoting chassis allowing movement within the e-pen 1712. Sensorelectrodes 1-4, which may be viewed as being secondary sensor electrodesof the e-pen 1712, are implemented around the sensor electrode 0.Examples of the sensor electrode 0 include center sensor electrode,primary sensor electrode, pivoting, etc.

As the primary sensor electrode 0 moves and pivots such as when in use,its relative location with respect to the secondary sensor electrodes1-4 will change. For example, the distances between the primary sensorelectrode 0 and the secondary sensor electrodes 1-4 will change as theprimary sensor electrode 0 moves within a pivot-capable chassis.Different respective DSCs are implemented simultaneously to drive and tosense respective signals via the respective sensor electrodes. Forexample, a first DSC is implemented simultaneously to drive and to sensea first signal via the primary sensor electrode 0. A second DSC isimplemented simultaneously to drive and to sense a second signal via thesecondary sensor electrode 1, a third DSC is implemented simultaneouslyto drive and to sense a third signal via the secondary sensor electrode2, a fourth DSC is implemented simultaneously to drive and to sense afourth signal via the secondary sensor electrode 3, and a fifth DSC isimplemented simultaneously to drive and to sense a fifth signal via thesecondary sensor electrode 4.

As these respective signals are driven the of the respective sensorelectrodes of the e-pen 1712, when the e-pen 1712 is interacting withone or more touch sensors (e.g., of such a device that includes the oneor more touch sensors), the respective signals provided from therespective sensor electrodes of the e-pen 1712 are coupled into the oneor more touch sensors, which are located sufficiently close to therespective sensor electrodes of the e-pen 1712 four signal coupling,such that one or more DSCs associated with those one or more touchsensor electrodes will be able to detect the respective signals providedfrom the respective sensor electrodes of the e-pen 1712.

For example, consider the first signal that is driven via the primarysensor electrode 0. As the e-pen 1712 is interacting with the one ormore touch sensors, then those touch sensors that are within proximityof the primary sensor electrode 0 will detect that first signal. The oneor more DSCs associated with those one or more touch sensor electrodeswill be able to detect the first signal provided from the primary sensorelectrode 0 of the e-pen 1712. Similarly, other signals driven via theother respective sensor electrodes of the e-pen 1712, when those otherrespective sensor electrodes of the e-pen 1712 are sufficiently close tothe one or more touch sensors, will also be coupled into those one ormore touch sensors.

Also, with respect to this diagram as well as other examples,embodiments, and their equivalents described herein, note that signaldriving and detection may be performed from an e-pen to the one or moretouch sensors and also from the one or more touch sensors to the e-pen.Note that while a DSC is configured to perform simultaneous driving andsensing of a respective signal via an e-pen sensor electrode or a touchsensor, note that detection of other signals that are coupled into thate-pen sensor electrode or touch sensor is also performed. In general,any signal that gets coupled into an e-pen sensor electrode or a touchsensor via which DSC is configured to perform simultaneous driving andsensing may be detected. That is to say, not only is simultaneousdriving and sensing of the signal that is provided from the DSC to thee-pen sensor electrode or the touch sensor performed, but alsodetection, sensing, processing, etc. is performed of any other signalthat is coupled into that e-pen sensor electrode or touch sensor.

In general, while this diagram shows four secondary sensor electrodesencompassing the primary sensor electrode 0 within the e-pen 1712, notethat any desired number of secondary sensor electrodes may beimplemented within alternative embodiments of an e-pen (e.g., 3, 5, etc.or any other number of secondary sensor electrodes).

FIG. 17B is a schematic block diagram of another embodiment 1702 of ane-pen in accordance with the present invention. This diagram has somesimilarities to the prior diagram. This diagram includes an e-pen 1722that may optionally include a power source 1728 therein (e.g., such asto provide power to one or more DSCs coupled to the respective sensorelectrodes). The e-pen 1722 includes multiple respective sensorelectrodes. For example, the e-pen 1712 includes sensor electrodes 0, 1a, 2 a, 3 a, and 4 a. The sensor electrode 0 may be viewed as being acenter sensor electrode 0, a primary sensor electrode 0, implementedwithin a pivoting chassis allowing movement within the e-pen 1712.Examples of secondary sensor electrode 0 include center sensorelectrode, primary sensor electrode, pivoting, etc.

This diagram is different from the prior diagram such that secondarysensor electrodes 1-4 of the prior diagram are instead implemented basedon sets of secondary sensor electrodes. For example, in place of thesecondary sensor electrode 1 of the prior diagram is instead implementedwith a set of secondary electrodes 1 a, 1 b, and optionally up to 1 n(where n is a positive integer greater than or equal to 3). Examples ofsecondary sensor electrode(s) 1 include secondary sensor electrode(s) 1a, 1 b, . . . 1 n). Similarly, the other secondary sensor electrodes 2,3, 4 are replaced by different respective sets of secondary electrodes.For example, secondary sensor electrode 2 of the prior diagram isinstead implemented with a set of secondary electrodes 2 a, 2 b, andoptionally up to 2 n (where n is a positive integer greater than orequal to 3). Examples of secondary sensor electrode(s) 2 includesecondary sensor electrode(s) 2 a, 2 b, 2 n). Similarly, the othersecondary sensor electrodes are instead implemented with respective setsof secondary electrodes. Examples of secondary sensor electrode(s) 3include secondary sensor electrode(s) 3 a, 3 b, . . . 3 n). Examples ofsecondary sensor electrode(s) 4 include secondary sensor electrode(s) 4a, 4 b, . . . 4 n).

The use of more than one secondary sensor electrode around the primarysensor electrode 0 allows for greater granularity regarding theposition, orientation, till, etc. of the primary sensor electrode 0within the e-pen 1722. For example, as the primary sensor electrode 0tilts within the e-pen 1722, information provided from signals that aredriven and sentenced to be a he respective secondary sensor electrodessurrounding the primary sensor electrode 0 allow for greaterdetermination on the position, orientation, till, etc. of the primarysensor electrode 0 within the e-pen 1722.

In general, while these diagrams show sets of four secondary sensorelectrodes encompassing the primary sensor electrode 0 within the e-pen1722, note that any desired number of secondary sensor electrodes may beimplemented within alternative embodiments of an e-pen (e.g., 3, 5, etc.or any other number of sets of secondary sensor electrodes). Note alsothat the arrangement of the different respective secondary sensorelectrodes may not be uniform throughout the e-pen 1722. For example, afirst set of secondary electrodes encompassing the primary sensorelectrode 0 within the e-pen 1722 may include 4 secondary sensorelectrodes, and a second set of secondary electrodes encompassing theprimary sensor electrode 0 within the e-pen 1722 may include 5 secondarysensor electrodes, etc. The arrangement and configuration of thedifferent respective secondary sensor electrodes may very along theaxial length of the primary sensor electrode 0 within the e-pen 1722.

The following two diagrams have some similarity to the previous twodiagrams with at least one difference being that one or more sensorelectrodes are implemented at an erasing end of an e-pen. For example,the previous two diagrams show various examples of sensor electrodesimplemented at a writing end of an e-pen, and the use following twodiagrams include both writing any erasing capability. For example,writing capability includes operating in the e-pen, display device, etc.in such a way to produce content on the display device based oninteraction of the e-pen with the display device, whereas erasingcapability includes operating in the e-pen, display device, etc. in sucha way to remove content from the display device based on interaction ofthe e-pen with the display device.

For example, consider an example where writing operation produces thatis visible on the display device based on interaction of the e-pen withthe display device (e.g., provides content based on the path that thee-pen travels on a touchscreen, display, etc.). In contradistinction,consider an example where erasing operation removes content that isvisible on the display device based on interaction of the e-pen with thedisplay device (e.g., removes based on the path that the e-pen travelson a touchscreen, display, etc.). In certain examples, note thatdifferent respective ends of an e-pen are implemented for writing anderasing operation. However, in some examples, note that both writingoperation and erasing operation may be implemented using the same end ofan e-pen (e.g., such as toggling between the two operations based onuser selection, operation of a switch, toggle between writing operationand erasing operation, etc.). In some examples, the e-pen includes oneor more means thereon (e.g., one or more button, one or more switches,etc.) by which a user may select writing operation or erasing operation.On other examples, user interaction with a touch sensor deviceassociated with the e-pen effectuates selection of writing operation orerasing operation (e.g., a button, user interface, etc. shown on adisplay of a touch sensor device allows a user to select writingoperation or erasing operation).

FIG. 18A is a schematic block diagram of another embodiment 1801 of ane-pen in accordance with the present invention. This diagram includes ane-pen 1822 that may optionally include a power source 1818 therein(e.g., such as to provide power to one or more DSCs coupled to therespective sensor electrodes). The e-pen 1822 includes multiplerespective sensor electrodes including at both ends of the e-pen 1822.

For example, the e-pen 1822 includes sensor electrodes 01, 11 a, 21 a,31 a, and 41 a and optionally up to 11 a, 21 n, 31 n, and 41 n on thewriting end of the e-pen 1822. The sensor electrode 01 may be viewed asbeing a center sensor electrode 01, a primary sensor electrode 01,implemented within a pivoting chassis allowing movement within the e-pen1822 on the writing end of the e-pen 1822. Examples of secondary sensorelectrode 01 include center sensor electrode, primary sensor electrode,pivoting, etc. Examples of secondary sensor electrode(s) 11 includesecondary sensor electrode(s) 11 a, 11 b, . . . 11 n). Examples ofsecondary sensor electrode(s) 31 include secondary sensor electrode(s)31 a, 31 b, . . . 31 n).

Similarly, on an erasing end of the e-pen 1822, the e-pen 1822 includessensor electrodes 02, 12 a, 22 a, 32 a, and 42 a and optionally up to 12a, 22 n, 31 n, and 42 n. The sensor electrode 01 may be viewed as beinga center sensor electrode 02, a primary sensor electrode 02, implementedwithin a pivoting chassis allowing movement within the e-pen 1822 on theerasing end of the e-pen 1822. Examples of secondary sensor electrode 02include center sensor electrode, primary sensor electrode, pivoting,etc. Examples of secondary sensor electrode(s) 12 include secondarysensor electrode(s) 12 a, 12 b, . . . 12 n). Examples of secondarysensor electrode(s) 32 include secondary sensor electrode(s) 32 a, 32 b,32 n).

The construction and implementation of the different respective ends ofthe e-pen 1822 may be similar, but the functionality thereof isdifferent. On one end of the e-pen 1822, the respective signals that aredriven and simultaneously sent via the DSCs associated with those sensorelectrodes correspond to writing operations. On the other end of thee-pen 1822, the respective signals that are driven and simultaneouslysent via the DSCs associated with those sensor electrodes correspond toerasing operations.

FIG. 18B is a schematic block diagram of another embodiment 1802 of ane-pen in accordance with the present invention. This diagram includes ane-pen 1822-1 that may optionally include a power source 1828 therein(e.g., such as to provide power to one or more DSCs coupled to therespective sensor electrodes). The e-pen 1822-1 includes multiplerespective sensor electrodes including a singular sensor electrode atthe erasing end of the e-pen 1822-1.

For example, the e-pen 1822-1 includes sensor electrodes 01, 11 a, 21 a,31 a, and 41 a and optionally up to 11 a, 21 n, 31 n, and 41 n on thewriting end of the e-pen 1822-1. The sensor electrode 01 may be viewedas being a center sensor electrode 01, a primary sensor electrode 01,implemented within a pivoting chassis allowing movement within the e-pen1822-1 on the writing end of the e-pen 1822-1. Examples of secondarysensor electrode 01 include center sensor electrode, primary sensorelectrode, pivoting, etc. Examples of secondary sensor electrode(s) 11include secondary sensor electrode(s) 11 a, 11 b, . . . 11 n). Examplesof secondary sensor electrode(s) 31 include secondary sensorelectrode(s) 31 a, 31 b, . . . 31 n).

However, on an erasing end of the e-pen 1822-1, the e-pen 1822-1includes a single sensor electrode 02-1, which may be viewed as being acenter sensor electrode 02-1, a primary sensor electrode 02-1,implemented on the erasing end of the e-pen 1822-1. Examples of singlesensor electrode 02-01 include center sensor electrode, primary sensorelectrode, pivoting, etc.

The construction and implementation of the different respective ends ofthe e-pen 1822-1 is different in this diagram. On one end of the e-pen1822-1, the respective signals that are driven and simultaneously sentvia the DSCs associated with those sensor electrodes correspond towriting operations. On the other end of the e-pen 1822-1, the singularsignal provided via DSC associated with the single sensor electrode 02-1corresponds to erasing operations.

In general, note that any combination of writing and/or erasing ends andimplementations thereof of an e-pen may be implemented. For example, anthe e-pen may include a primary sensor electrode surrounded by onesingle set of secondary sensor electrodes. An e-pen may alternativelyinclude a primary sensor electrode surrounded by multiple sets ofsecondary sensor electrodes. Any such e-pen may include any desiredimplementation of an erasing end (e.g., which may be implemented using asingle sensor electrode or multiple sensor electrodes).

FIG. 19 is a schematic block diagram of embodiments 1900 of differentsensor electrode arrangements within e-pens in accordance with thepresent invention. This diagram shows different respective numbers ofsecondary electrodes implemented to surround a primary sensor electrode.Note that such a primary sensor electrode may be implemented in apivot-capable type chassis that allows movement of it with respect tothe secondary sensor electrodes that surround it. In an example, aprimary sensor electrode (PE) 0, is implemented as being movable,pivoting within e-pen based on user operation and/or interaction withtouch sensor device.

As can be seen with respect to reference numeral 1901, 4 secondarysensor electrodes are implemented around a primary sensor electrode. Inthis example, the respective secondary sensor electrodes areapproximately and/or substantially and/or substantially of a common sizeand shape, being rectangular in shape, and distributed evenly around theprimary sensor electrode.

Reference numeral 1902 shows 6 secondary electrodes implemented aroundthe primary sensor electrode. In this example, the respective secondarysensor electrodes are also approximately and/or substantially of acommon size and shape, being rectangular in shape, and distributedevenly around the primary sensor electrode.

Reference numeral 1903 shows 8 secondary electrodes implemented aroundthe primary sensor electrode. In this example, the respective secondarysensor electrodes are also approximately and/or substantially of acommon size and shape, being rectangular in shape, and distributedevenly around the primary sensor electrode.

Reference numeral 1904 shows 4 secondary sensor electrodes areimplemented around a primary sensor electrode. In this example, therespective secondary sensor electrodes are not of a common size andshape. The sensor electrode (SE) 1 and 3 are approximately and/orsubstantially the common first size and first shape, and the SEs 2 and 4are approximately and/or substantially the common second size and secondshape. Note that while they are all approximately and/or substantiallyrectangular in shape, they are of different sizes and shapes.

Reference numeral 1905 shows 3 secondary electrodes implemented aroundthe primary sensor electrode. In this example, the respective secondarysensor electrodes are also approximately and/or substantially of acommon size and shape, being each being curved and partially concentricaround the primary sensor electrode and distributed evenly around theprimary sensor electrode.

Reference numeral 1905 shows 4 secondary electrodes implemented aroundthe primary sensor electrode. In this example, the respective secondarysensor electrodes are also approximately and/or substantially of acommon size and shape, being each being curved and partially concentricaround the primary sensor electrode and distributed evenly around theprimary sensor electrode.

With respect to any of these examples or their equivalents, note thatmore than one sensor may be implemented along the axis of the primarysensor electrode. For example, as described above with respect tocertain diagrams that include more than one set of secondary sensorelectrodes encompassing the primary sensor electrode, any of theseexamples or their equivalents may also include more than one set ofsecondary sensor electrodes encompassing the primary sensor electrode.Note also that, along the axis of the primary sensor electrode, thedifferent respective sets of secondary sensor electrodes may vary. Forexample, a set of secondary sensor electrodes based on theimplementation of reference 1901 may be implemented first, a set ofsecondary sensor electrodes based on the limitation of reference numeral1905 may be implemented next, and so on. Any desired implementationhaving varied types of secondary sensor electrodes may be implemented asdesired in various embodiments and examples. Generally speaking, anydesired number n of sensor electrodes may be implemented aroundprimary/center sensor electrode and in any configuration, shape, size,etc., uniform, non-uniform, etc., combination of different types, etc.

FIG. 20 is a schematic block diagram of an embodiment 2000 of an e-peninteracting touch sensors in accordance with the present invention. Thisdiagram shows an e-pen 2012 implemented to interact with one or moretouch sensors 2010 (e.g., touch sensor electrodes). Note that the one ormore touch sensors 2010 may be implemented within any type of device asdescribed herein. In an example, unique respective signals areimplemented for each column and row sensor electrode and element withinan e-pen (e.g., for any desired combination of operation such as somedrive/TX only and with others TX/RX, drive/sense). In an alternativeimplementation, time-division is used in accordance with signal re-use.Consider a 2-D grid of row and column (R,C) electrodes (e.g.,cross-sections, intersections, etc. of R,C electrodes used to IDlocation of e-pen signals, cross-coupling locations, x-y mapping, etc.).

This diagram shows a cross-section of rows and columns of a touchscreenand portions of the associated one or more touch sensors 2010. MultipleDSCs are implemented simultaneously to drive and to sense signalsprovided via the respective sensor electrodes of the e-pen 2012 and thetouch sensors. Note that the different respective signals provided tothe respective sensor electrodes of the e-pen 2012 and the touch sensorsmay be differentiated using any one or more characteristics as describedherein including frequency, amplitude, DC offset, modulation, FEC/ECC,type, etc. and/or any other characteristic that may be used todifferentiate signals provided to different respective e-pen sensorelectrodes and touch sensors.

For example, unique respective signals are provided to the column androw sensor electrodes of a touchscreen. The signals provided to thecolumn sensor electrodes of the touchscreen are depicted as s_(r1),s_(r2), and so on, and the column signals are signals are depicted ass_(c1), s_(c2), and so on. The signals provided to the sensor electrodesof the e-pen 2012 are depicted as s_(p0), s_(p1), s_(p2), and so on. Inan example, signal #a includes a first frequency, a first amplitude, afirst DC offset, a first modulation, a first FEC/ECC, a first type(e.g., fa, amp. a, DC off. a, mod. a, FEC/ECC a, type, etc.), and signal#b includes a second frequency, a second amplitude, a second DC offset,a second modulation, a second FEC/ECC, a second type (e.g., fb, amp. b,DC off. b, mod. b, FEC/ECC b, type, etc.).

Again, note that coupling of signals from the sensor electrodes of thee-pen 2012 may be made into the column and row sensor electrodes of thetouchscreen, and vice versa. For example, signals coupled from thecolumn and row sensor electrodes of the touchscreen into the sensorelectrodes of the e-pen 2012 may be detected by the one or more DSCsthat are configured simultaneously to drive in to sense signals via therespective sensor electrodes of the e-pen 2012.

One or more processing modules associated with a device that includesthe one or more touch sensors 2010 and the e-pen 2012 is configured toprocess information associated with the signals that are driven andsimultaneously sensed by the DSCs that are associated with the columnand row sensor electrodes of the touchscreen and the sensor electrodesof the e-pen 2012 to determine various information including thelocation of the e-pen 2012 with respect to the touchscreen, theorientation, tilt, etc. of the e-pen 2012, which particular signals arecoupled from the one or more touch sensors 2010 to the e-pen 2012, andvice versa, the amount of signal coupling from the one or more touchsensors 2010 to the e-pen 2012, and vice versa, etc.

In an example of operation and implementation, one or more processingmodules is configured to process information corresponding to one ormore signals that are detected as being coupled from the e-pen 2012 tothe row and column electrodes of the touch sensors 2010. Based on amapping (e.g., x-y, a two-dimensional mapping) of the row and columnelectrodes relative to the touchscreen, and based on the particularlocations at which those one or more signals are detected as beingcoupled from the e-pen 2012 to the row and column electrodes, the one ormore processing modules is configured to determine particularly thelocations of the sensor electrodes of the e-pen 2012 based on the rowand column electrodes of the touch sensors 2010. For example, locationof coupling of a signal from a sensor electrode of the e-pen 2012 may bedetermined based on that signal being detected within a particular rowelectrode and column electrode. The cross-section of that row electrodeand that column electrode, based on the mapping of the row and columnelectrodes, provides the location of the sensor electrode of the e-pen2012. This process may be performed with respect to any one or more ofthe different respective signals coupled from the sensor electrodes ofthe e-pen 2012 to the row and column electrodes of the touch sensors2010.

FIG. 21 is a schematic block diagram of another embodiment 2100 of ane-pen interacting with touch sensors in accordance with the presentinvention. The top portion of this diagram includes a side view of ane-pen 2122, which may optionally include a power source 2128 as needed,that is interacting with one or more touch sensors 2110. This includes across-section of rows and columns of a touchscreen. Consider a 2-D gridof row and column (R,C) electrodes (e.g., cross-sections, intersections,etc. of R,C electrodes used to ID location of e-pen signals,cross-coupling locations, x-y mapping, etc.).

In this implementation, the e-pen 2122 includes a primary sensorelectrode and one or more sets of secondary sensor electrodes thatsurround the primary sensor electrode. The tilt, angle, etc. of thee-pen 2122 relative to the touchscreen changes the capacitance betweenthe respective sensor electrodes of the e-pen and the row and columnsensor electrodes of the touchscreen. In an example, the tilt, angle,etc. changes capacitance between respective sensor electrodes of e-penand/or to sensor electrodes (rows/cols. of touchscreen). There is alsocoupling of signals from e-pen sensor electrodes to touch sensorelectrodes, and vice versa. Considering an example in which the e-pen2122 is perfectly normal to the surface of the touchscreen, meaning theaxis of the primary sensor electrode is perpendicular to the surface ofthe touchscreen in all respects, then the capacitance of the secondarysensor electrodes and row and column electrodes of the touchscreen wouldbe the same (e.g., assuming a uniform implementation of the secondarysensor electrodes within the e-pen 2122).

However, as the e-pen 2122 is tilted relative to the surface of thetouchscreen, then some of the secondary sensor electrodes will be closerto the row and column electrodes of the touchscreen than others. As canbe seen in the diagram, considering the secondary sensor electrodescloser to the writing end/tip the e-pen 2122 that surround the primarysensor electrode, as the e-pen 2122 is tilted. For example, considersecondary sensor electrode, SE 11 and SE 21. As the e-pen 2122 istilted, SE 11 will be farther from the surface of the touchscreen thanSE 21. More effective capacitive coupling will be provided from SE 21 tothe proximately located row and column electrodes of the touchscreenthan from SE 11 in this instance.

The bottom portion of this diagram includes a top view of the couplingof signals from the e-pen sensor electrodes to the row and columnelectrodes of the touchscreen, and vice versa. Note that there will be aspatial mapping of signals coupled from the e-pen 2122 to the row andcolumn electrodes of the touchscreen, and vice versa. This diagram doesnot specifically show the different intensities of the respectivesignals on a per sensor electrode basis, but shows the general area viawhich coupling of signals is made between the e-pen 2122 and the row andcolumn electrodes of the touchscreen.

Note that as the e-pen 2122 is interacting with touchscreen and as thelocation of the e-pen 2122 changes, such as from user control of thee-pen 2122 in writing, drawing, erasing, etc. operations, the profile ofcoupling of signals between the e-pen 2122 and the row and columnelectrodes of the touchscreen, will be changing. A dynamic mapping ofthe profile of signals between the e-pen 2122 and the row and columnelectrodes of the touchscreen as well as identification of particularsignals being within the profile may be used to provide for specificlocation of the sensor electrodes of the e-pen 2122 at any given timeand as a function of time. In an example, there is generated a profileof coupling of signals from the e-pen sensor electrodes to the touchsensor(s), and vice versa (e.g., spatial mapping of signals, indicativeof e-pen orientation). The spatial mapping of these signals providesinformation related to location of the e-pen 2122 with respect to thetouchscreen and also provides information related to the tilt,orientation, position, etc. of the e-pen 2122. As described with respectto other embodiments, examples, etc. note that particular configurationsof sensor electrodes within an e-pen may provide for greater granularityand resolution regarding its particular location respect the touchscreenand also information related to its tilt, orientation, position, etc.

FIG. 22 is a schematic block diagram of another embodiment 2200 of ane-pen interacting with touch sensors in accordance with the presentinvention. This diagram shows particularly coupling between therespective sensor electrodes of an e-pen and the row and columnelectrodes of the touchscreen. At the top of the diagram, the profile ofthe coupling of the signals is shown, which is similar to the profile ofcoupling of signals in the prior diagram.

At the bottom portion of the diagram, an enlargement of the coupling ofthe respective sensor electrodes of the e-pen are shown. The e-pen ofthis diagram may be viewed as being similar to the e-pen 1722 of FIG.17B, the e-pen 1822 of FIG. 18A (writing end), or the e-pen 1822-1 ofFIG. 18B (writing end) that includes a primary sensor electrode 01 andmultiple sets of secondary sensor electrodes (e.g., a first setincluding secondary sensor electrodes 11, 21, 31, 41, and optionally upto an nth set including secondary sensor electrodes 1 n, 2 n, 3 n, 4 n).

In an example of operation and implementation, consider an example inwhich the e-pen is perfectly normal to the surface of the touchscreen,meaning the axis of the primary sensor electrode is perpendicular to thesurface of the touchscreen in all respects, then the capacitance of thesecondary sensor electrodes and row and column electrodes of thetouchscreen would be the same. There would be very strong capacitivecoupling of the driven via the primary sensor electrode of the e-pen tothe row and or column electrodes of the touchscreen closest to theprimary sensor electrode of the e-pen. In addition, the capacitivecoupling from the respective secondary sensor electrodes 11, 21, 31, 41would be approximately and/or substantially uniform to row and or columnelectrodes of the touchscreen surrounding the location of the primarysensor electrode of the e-pen.

In another example of operation and implementation, consider an exampleof operation and implementation based on the location and orientation ofthe e-pen the prior diagram, the coupling via primary sensor electrode01 would be greatest among the sensor electrodes of the e-pen given thatit is in physical contact with the surface of the touchscreen. As thee-pen 2122 is tilted, sensor electrode (SE) 11 will be farther from thesurface of the touchscreen than SE 21. More effective capacitivecoupling will be provided from SE 21 to the proximately located row andcolumn electrodes of the touchscreen than from SE 11 in this instance.In addition, more effective coupling will be provided from the sensorelectrodes (SEs) 11, 21, 31, 41 than from the SEs 1 n, 2 n, 3 n, 4 nbased on the location and orientation of the e-pen the prior diagram.For example, analysis of a signal profile of the coupling from thesensor electrodes aligned along the e-pen (e.g., SEs 11, 12, up to 1 n)provide information regarding the angular position of the e-pen relativeto the service of the touchscreen. Based on a signal profile of thecoupling from those sensor electrodes aligned along the e-pen (e.g., SEs11, 12, up to 1 n) being uniform, meaning approximately and/orsubstantially same signal coupling from each of the those sensorelectrodes aligned along the e-pen (e.g., SEs 11, 12, up to 1 n), then adetermination that the axis of the e-pen is parallel to the surface ofthe touchscreen may be made. In addition, analysis of how much signalcoupling is provided from the respective sensor electrodes will provideinformation regarding the proximity of the e-pen to the service of thetouchscreen.

In general, analysis of the location, signal strength, intensity, and orother characteristics associated with the different respective signalscoupled from the sensor electrodes of the e-pen to the row and columnelectrodes of the touchscreen provides for information regarding thelocation of the e-pen with respect to the service of the touchscreen aswell as the tilt, orientation, etc. of the e-pen. Considering the twoextreme examples described above, one in which the e-pen is normal tothe surface of the touchscreen and another in which the e-pen isparallel to the surface of the touchscreen, considering when the e-penis located somewhere in between those two extremes, such as in a tiltedimplementation shown in the prior diagram, analysis of the relationshipsbetween those respective signals will provide that information regardingthe location of the e-pen with respect to the service of the touchscreenas well as the tilt, orientation, etc. of the e-pen. In some examples,analysis of the various signals that are coupled from the sensorelectrodes of the e-pen to the row and column electrodes of thetouchscreen may be associated geometrically with respect to the tilt,orientation, etc. of the e-pen.

As an example, considering a signal profile of the coupling from thosesensor electrodes aligned along the e-pen (e.g., SEs 11, 12, up to 1 n)degrades by 3 DB is a function of distance (e.g., one half as muchcapacitive coupling of the signal via SE 12 is made as the signal via SE11, and one half as much capacitive coupling of the signal via SE 13 ismade as the signal via SE 12, etc.), then an estimation of the angle ofthe e-pen with respect to the service of the touchscreen can be made. Inone example, an estimation of that angle x is made based on thegeometric function sin x where the vertical component of a righttriangle opposite the angle x corresponds to the difference between thesignal coupling via SE 12 and via SE 13 (e.g., height, h1, of the righttriangle), and the hypotenuse of that same right triangle corresponds tothe distance between the SE 12 and via SE 13 within the e-pen (e.g.,hypotenuse, h2, of the right triangle).

Other geometric estimations may be made using various geometricfunctions such as cos x, tan x, etc. based on the known or determinedphysical parameters of an e-pen (e.g., the physical configuration of thesensor electrodes therein, their relationship to one another, theirspacing, etc.) and associating those relationships to thecharacteristics associated with the signals detected as beingcapacitively coupled from the sensor electrodes of the e-pen to the rowand column electrodes of the touchscreen.

In an example of operation and implementation, one or more processingmodules is configured to perform appropriate processing of the relativesignal strengths, intensities, magnitude, of the signals coupled fromthe sensor electrodes of the e-pen to the row and column sensorelectrodes of the touchscreen to determine the location of the e-penwith respect to the touchscreen as well as the tilt, orientation, etc.of the e-pen.

FIG. 23 is a schematic block diagram of an embodiment of a method 2300for execution by one or more devices in accordance with the presentinvention. The method 2300 operates in step 2310 by transmitting a firstsignal having a first frequency via a sensor electrode of one or moretouch sensors. The method 2300 also operates in step 2320 by detecting achange of a first signal having a first frequency via the sensorelectrode of the one or more touch sensors. Note that the operationsdepicted within the steps 2310 and 2320 may be performed in accordancewith any of the variations, examples, embodiments, etc. of one or moreDSCs as described herein that is/are configured to perform simultaneoustransmit and receipt of signals (simultaneous drive and detect ofsignals).

The method 2300 continues in step 2330 by processing the change of thefirst signal having the first frequency to generate digital informationcorresponding to user interaction and/or e-pen interaction with thesensor electrode of the one or more touch sensors.

In some examples, note that such operations as depicted within the steps2310, 2320, and 2330 may be performed using one or more additionalsignals and one or more sensor electrodes. For example, in someinstances, a second signal having a second frequency is associated witha first sensor electrode of an e-pen. In such examples, the method 2300also operates in step 2314 by transmitting the second signal having thesecond frequency via the first sensor electrode of an e-pen. The method2300 also operates in step 2324 by detecting a change of the secondsignal having the second frequency via the sensor electrode of thee-pen.

The method 2300 continues in step 2334 by processing the change of thesecond signal having the second frequency to generate other digitalinformation corresponding to user interaction with the sensor electrodeof the e-pen.

As also described elsewhere herein with respect to other examples,embodiments, etc., note that coupling of signals may be performed fromsensor electrodes of the e-pen to sensor electrodes of the touchsensors, and vice versa. Detection of signals being coupled from thee-pen to the sensor electrodes of the touch sensors, and vice versa, maybe performed by appropriate signal processing including analysis of thedigital information corresponding to such user and/or e-pen interactionwith the various sensor electrodes. In this method 2300, differentiationbetween the different respective signals provided via the sensorelectrode of the touch sensors and the sensor electrode of the e-pen ismade in frequency.

Variants of the method 2300 operate by operating a first drive-sensecircuit (DSC) of the e-pen, which includes a plurality of e-pen sensorelectrodes including a first e-pen sensor electrode and a second e-pensensor electrode, and a plurality of drive-sense circuits (DSCs),including the first DSC and a second DSC, operably coupled to theplurality of e-pen sensor electrodes, to drive a first e-pen signalhaving a first frequency via a first single line coupling to the firste-pen sensor electrode and simultaneously sense, via the first singleline, the first e-pen signal, wherein based on interaction of the e-penwith a touch sensor device, the first e-pen signal is coupled into atleast one touch sensor electrode of the touch sensor device. This alsoinvolves operating the first DSC of the e-pen to process the first e-pensignal to generate a first digital signal that is representative of afirst electrical characteristic of the first e-pen sensor electrode.

This also involves operating the second DSC to drive a second e-pensignal having a second frequency that is different than the firstfrequency via a second single line coupling to the second e-pen sensorelectrode and simultaneously sense, via the second single line, thesecond e-pen signal, wherein based on the interaction of the e-pen withthe touch sensor device, the second e-pen signal is coupled into the atleast one touch sensor electrode. In addition, this also involvesoperating the second DSC of the e-pen to process the second e-pen signalto generate a second digital signal that is representative of a secondelectrical characteristic of the second e-pen sensor electrode.

In some examples, this also involves processing at least one of thefirst digital signal or the second digital signal to detect theinteraction of the e-pen with the touch sensor device.

Certain other examples also operate by operating a third DSC operablycoupled to a first touch sensor electrode of the at least one touchsensor electrode to drive a touch sensor signal having a third frequencyvia a third single line coupling to the first touch sensor electrode andsimultaneously sense, via the third single line, the touch sensorsignal, wherein based on the interaction of the e-pen with the touchsensor device, sensing the touch sensor signal includes sensing at leastone of the first e-pen signal that is coupled from the first e-pensensor electrode into the first touch sensor electrode or the seconde-pen signal that is coupled from the second e-pen sensor electrode intothe first touch sensor electrode. This also involves operating the thirdDSC process the touch sensor signal to generate a third digital signalthat is representative of a third electrical characteristic of the firsttouch sensor electrode. Also, such examples operate by processing thethird digital signal to determine location of at least one of the firste-pen sensor electrode or the second e-pen sensor electrode based on theinteraction of the e-pen with the touch sensor device.

Even other examples involve a touch sensor device that also includesanother plurality of DSCs, including a third DSC and a fourth DSC,operably coupled to a plurality of touch sensor electrodes, including afirst touch sensor electrode and a second touch sensor electrode,including the at least one touch sensor electrode. In such examples, theoperations also involve operating the third DSC to drive a first touchsensor signal having a third frequency via a third single line couplingto the first touch sensor electrode and simultaneously sense, via thethird single line, the first touch sensor signal, wherein based on theinteraction of the e-pen with the touch sensor device, sensing the firsttouch sensor signal includes sensing at least one of the first e-pensignal that is coupled from the first e-pen sensor electrode into thefirst touch sensor electrode or the second e-pen signal that is coupledfrom the second e-pen sensor electrode into the second touch sensorelectrode. This also involves operating the third DSC to process thefirst touch sensor signal to generate a third digital signal that isrepresentative of a third electrical characteristic of the first touchsensor electrode.

In such examples, this also involves operating the fourth DSC to drive asecond touch sensor signal having a fourth frequency that is differentthan the first frequency via a fourth single line coupling to the secondtouch sensor electrode and simultaneously sense, via the fourth singleline, the second touch sensor signal, wherein based on the interactionof the e-pen with the touch sensor device, sensing the second touchsensor signal includes sensing at least one of the first e-pen signalthat is coupled from the first e-pen sensor electrode into the firsttouch sensor electrode or the second e-pen signal that is coupled fromthe second e-pen sensor electrode into the second touch sensorelectrode. Note that this also involves operating the fourth DSC toprocess the second touch sensor signal to generate a fourth digitalsignal that is representative of a fourth electrical characteristic ofthe second touch sensor electrode.

In addition, certain variants also include processing the third digitalsignal and the fourth digital signal to determine location of at leastone of the first e-pen sensor electrode or the second e-pen sensorelectrode based on the interaction of the e-pen with the touch sensordevice and also based on a two-dimensional mapping of a touchscreen ofthe touch sensor device that uniquely identifies an intersection of thefirst touch sensor electrode and the second touch sensor electrode.

FIG. 24 is a schematic block diagram of another embodiment of a method2400 for execution by one or more devices in accordance with the presentinvention. This diagram has similarity to the previous diagram with atleast one difference being that more than one signal is driven via morethan one sensor electrode of the touch sensors, and more than one signalis driven via more than one sensor electrode of the e-pen. In general,note that any desired number of signals may be simultaneously driven andsensed, and differentiated from one another in frequency, via therespective sensor electrodes of the touch sensors and the e-pen. In thisexample as well as others, note that more than one e-pen may beoperative at a given time in conjunction with a given one or more touchsensors. For example, more than one e-pen associate with more than oneuser may be interactive and operative with a touch sensor device at atime.

The method 2400 operates in step 2410 by transmitting a first signalhaving a first frequency via a first sensor electrode of one or moretouch sensors. The method 2400 also operates in step 2420 by detecting achange of a first signal having a first frequency via the first sensorelectrode of the one or more touch sensors.

The method 2400 continues in step 2430 by processing the change of thefirst signal having the first frequency to generate digital informationcorresponding to user interaction and/or e-pen interaction with thefirst sensor electrode of the one or more touch sensors.

In addition, when multiple sensor electrodes of the one or more touchsensors in implemented in a device (e.g., up to n, where n is a positiveinteger greater than or equal to 2), similar operations as performedwith respect to the first sensor electrode may be performed with respectto the one or more additional sensor electrodes of the one or more touchsensors.

The method 2420 operates in step 2412 by transmitting a nth signalhaving a nth frequency via a nth sensor electrode of one or more touchsensors. The method 2400 also operates in step 2422 by detecting achange of a nth signal having a nth frequency via the nth sensorelectrode of the one or more touch sensors.

The method 2400 continues in step 2432 by processing the change of thenth signal having the nth frequency to generate digital informationcorresponding to user interaction and/or e-pen interaction with the nthsensor electrode of the one or more touch sensors.

In some examples, note that such operations as depicted within the steps2410, 2420, and 2430 (and optionally and 2412, 2422, and 2432) may beperformed using one or more additional signals and one or more sensorelectrodes. For example, in some instances, additional signal havingadditional frequencies are associated with respective sensor electrodesof an e-pen.

In such examples, the method 2400 also operates in step 2414 bytransmitting an nth signal having a nth frequency via a first sensorelectrode of an e-pen. The method 2400 also operates in step 2424 bydetecting a change of the nth signal having the nth frequency via thefirst sensor electrode of the e-pen. Note that the operations depictedwithin the steps 2414 and 2424 may be performed in accordance with anyof the variations, examples, embodiments, etc. of one or more DSCs asdescribed herein that is/are configured to perform simultaneous transmitand receipt of signals (simultaneous drive and detect of signals).

The method 2400 continues in step 2434 by processing the change of thenth signal having the nth frequency to generate other digitalinformation corresponding to user interaction with the first sensorelectrode of the e-pen.

In addition, when multiple sensor electrodes of the e-pen areimplemented (e.g., up to x, where x is a positive integer greater thanor equal to (x minus n)), similar operations as performed with respectto the first sensor electrode of the e-pen may be performed with respectto the one or more additional sensor electrodes of the e-pen.

In such examples, the method 2400 also operates in step 2414 bytransmitting an xth signal having a xth frequency via a yth sensorelectrode of an e-pen (e.g., where x and y are positive integersappropriately selected based on n, n+1, etc.). The method 2400 alsooperates in step 2424 by detecting a change of the xth signal having thexth frequency via the yth sensor electrode of the e-pen. Note that theoperations depicted within the steps 2414 and 2424 may be performed inaccordance with any of the variations, examples, embodiments, etc. ofone or more DSCs as described herein that is/are configured to performsimultaneous transmit and receipt of signals (simultaneous drive anddetect of signals).

The method 2400 continues in step 2434 by processing the change of thexth signal having the xth frequency to generate other digitalinformation corresponding to user interaction with the yth sensorelectrode of the e-pen.

In general, note that different respective signals that aresimultaneously driven and sensed via the respective sensor electrodes ofthe touch sensors and/or the e-pen are differentiated in terms offrequency.

Note that the operations depicted within the steps 2410 and 2420, 2422and 2422, 2414 and 2424, and 2416 and 2426 may be performed inaccordance with any of the variations, examples, embodiments, etc. ofone or more DSCs as described herein that is/are configured to performsimultaneous transmit and receipt of signals (simultaneous drive anddetect of signals).

This two diagram below have some similarities to the previous twodiagrams with at least one difference being that the respective e-penand touch sensor signals are differentiated by one or morecharacteristics that may include any one or more of frequency,amplitude, DC offset, modulation, modulation & coding set/rate (MCS),forward error correction (FEC) and/or error checking and correction(ECC), type, etc.

FIG. 25 is a schematic block diagram of another embodiment of a method2500 for execution by one or more devices in accordance with the presentinvention. The method 2500 operates in step 2510 by transmitting a firstsignal having a first one or more characteristics via a sensor electrodeof one or more touch sensors. The method 2500 also operates in step 2520by detecting a change of a first signal having a first one or morecharacteristics via the sensor electrode of the one or more touchsensors. Note that the operations depicted within the steps 2510 and2520 may be performed in accordance with any of the variations,examples, embodiments, etc. of one or more DSCs as described herein thatis/are configured to perform simultaneous transmit and receipt ofsignals (simultaneous drive and detect of signals).

The method 2500 continues in step 2530 by processing the change of thefirst signal having the first one or more characteristics to generatedigital information corresponding to user interaction and/or e-peninteraction with the sensor electrode of the one or more touch sensors.

In some examples, note that such operations as depicted within the steps2510, 2520, and 2530 may be performed using one or more additionalsignals and one or more sensor electrodes. For example, in someinstances, a second signal having a second one or more characteristicsis associated with a first sensor electrode of an e-pen. In suchexamples, the method 2500 also operates in step 2514 by transmitting thesecond signal having the second one or more characteristics via thefirst sensor electrode of an e-pen. The method 2500 also operates instep 2524 by detecting a change of the second signal having the secondone or more characteristics via the sensor electrode of the e-pen.

The method 2500 continues in step 2534 by processing the change of thesecond signal having the second one or more characteristics to generateother digital information corresponding to user interaction with thesensor electrode of the e-pen.

As also described elsewhere herein with respect to other examples,embodiments, etc., note that coupling of signals may be performed fromsensor electrodes of the e-pen to sensor electrodes of the touchsensors, and vice versa. Detection of signals being coupled from thee-pen to the sensor electrodes of the touch sensors, and vice versa, maybe performed by appropriate signal processing including analysis of thedigital information corresponding to such user and/or e-pen interactionwith the various sensor electrodes. In this method 2500, differentiationbetween the different respective signals provided via the sensorelectrode of the touch sensors and the sensor electrode of the e-pen ismade in frequency.

FIG. 26 is a schematic block diagram of another embodiment of a method2600 for execution by one or more devices in accordance with the presentinvention. This diagram has similarity to the previous diagram with atleast one difference being that more than one signal is driven via morethan one sensor electrode of the touch sensors, and more than one signalis driven via more than one sensor electrode of the e-pen. In general,note that any desired number of signals may be simultaneously driven andsensed, and differentiated from one another based on one or morecharacteristics, via the respective sensor electrodes of the touchsensors and the e-pen. In this example as well as others, note that morethan one e-pen may be operative at a given time in conjunction with agiven one or more touch sensors. For example, more than one e-penassociate with more than one user may be interactive and operative witha touch sensor device at a time.

The method 2600 operates in step 2610 by transmitting a first signalhaving a first one or more characteristics via a first sensor electrodeof one or more touch sensors. The method 2600 also operates in step 2620by detecting a change of a first signal having a first one or morecharacteristics via the first sensor electrode of the one or more touchsensors.

The method 2600 continues in step 2630 by processing the change of thefirst signal having the first one or more characteristics to generatedigital information corresponding to user interaction and/or e-peninteraction with the first sensor electrode of the one or more touchsensors.

In addition, when multiple sensor electrodes of the one or more touchsensors in implemented in a device (e.g., up to n, where n is a positiveinteger greater than or equal to 2), similar operations as performedwith respect to the first sensor electrode may be performed with respectto the one or more additional sensor electrodes of the one or more touchsensors.

The method 2620 operates in step 2612 by transmitting a nth signalhaving a nth one or more characteristics via a nth sensor electrode ofone or more touch sensors. The method 2600 also operates in step 2622 bydetecting a change of a nth signal having a nth one or morecharacteristics via the nth sensor electrode of the one or more touchsensors.

The method 2600 continues in step 2632 by processing the change of thenth signal having the nth one or more characteristics to generatedigital information corresponding to user interaction and/or e-peninteraction with the nth sensor electrode of the one or more touchsensors.

In some examples, note that such operations as depicted within the steps2610, 2620, and 2630 (and optionally and 2612, 2622, and 2632) may beperformed using one or more additional signals and one or more sensorelectrodes. For example, in some instances, additional signal havingadditional frequencies are associated with respective sensor electrodesof an e-pen.

In such examples, the method 2600 also operates in step 2614 bytransmitting an nth signal having a nth one or more characteristics viaa first sensor electrode of an e-pen. The method 2600 also operates instep 2624 by detecting a change of the nth signal having the nth one ormore characteristics via the first sensor electrode of the e-pen. Notethat the operations depicted within the steps 2614 and 2624 may beperformed in accordance with any of the variations, examples,embodiments, etc. of one or more DSCs as described herein that is/areconfigured to perform simultaneous transmit and receipt of signals(simultaneous drive and detect of signals).

The method 2600 continues in step 2634 by processing the change of thenth signal having the nth one or more characteristics to generate otherdigital information corresponding to user interaction with the firstsensor electrode of the e-pen.

In addition, when multiple sensor electrodes of the e-pen areimplemented (e.g., up to x, where x is a positive integer greater thanor equal to (x minus n)), similar operations as performed with respectto the first sensor electrode of the e-pen may be performed with respectto the one or more additional sensor electrodes of the e-pen.

In such examples, the method 2600 also operates in step 2614 bytransmitting an xth signal having a xth one or more characteristics viaa yth sensor electrode of an e-pen (e.g., where x and y are positiveintegers appropriately selected based on n, n+1, etc.). The method 2600also operates in step 2624 by detecting a change of the xth signalhaving the xth one or more characteristics via the yth sensor electrodeof the e-pen. Note that the operations depicted within the steps 2614and 2624 may be performed in accordance with any of the variations,examples, embodiments, etc. of one or more DSCs as described herein thatis/are configured to perform simultaneous transmit and receipt ofsignals (simultaneous drive and detect of signals).

The method 2600 continues in step 2634 by processing the change of thexth signal having the xth one or more characteristics to generate otherdigital information corresponding to user interaction with the ythsensor electrode of the e-pen.

In general, note that different respective signals that aresimultaneously driven and sensed via the respective sensor electrodes ofthe touch sensors and/or the e-pen are differentiated in terms of one ormore characteristics.

Note that the operations depicted within the steps 2610 and 2620, 2622and 2622, 2614 and 2624, and 2616 and 2626 may be performed inaccordance with any of the variations, examples, embodiments, etc. ofone or more DSCs as described herein that is/are configured to performsimultaneous transmit and receipt of signals (simultaneous drive anddetect of signals).

In addition, it is noted that with respect to any of the variousembodiments, examples, etc. described herein and their equivalents, notethat there may be instances in which a first at least one signal issimultaneously driven and sensed in accordance with DSC operation asdescribed herein, or its equivalent, while a second at least one signalis only driven or transmitted. For example, note that alternativevariations may include situations in which one or more signals areimplemented using DSC operation as described, or its equivalent, and oneor more other signals are implemented using an alternative technologyincluding only transmission capability. Note that any combination of oneor more DSCs in one or more other circuitries implemented to operate twoor more signals within a system may be employed in a desired embodiment.

FIG. 27 is a schematic block diagram of an embodiment 2700 ofdirectional mapping determination (e.g., North, South, East, and West(NSEW)) and orientation determination of an e-pen in accordance with thepresent invention. This diagram shows a user interacting with one ormore touch sensors 2710 of the device using an e-pen 2702. With respectto the device that includes the one or more touch sensors 2710, NSEWdirectionality is shown as North being towards the top, South being forthe bottom, West being towards the left, and East being towards theright of the device that includes the one or more touch sensors 2710.Note that alternative types of directionality may be used includingthose that have different numbers of subdivisions and granularity. Forexample, with respect to the NSEW directionality described, subdivisionsmay be included such as a Northwest directionality between North andWest, Northeast directionality between North and East, a North Northwestdirectionality between Northwest and West, etc. In general, any desireddirectionality and granularity may be used in accordance with such adevice. Alternatively, other nomenclature of directionality may be usedsuch as a direction 1, direction 2, direction 3, direction 4, etc.

In an example of operation and implementation, as a user interacts witha device that includes one or more touch sensors 2710 using an e-pen2702, two different tests are performed in accordance with the e-pen2702 interaction with the device that includes one or more touch sensors2710. As described above with respect to other examples, embodiments,etc. note that one or more processing modules, which may includeintegrated memory and/or be coupled to memory, is in communication withone or more DSCs that are implemented to perform simultaneous drivingand sensing of signals via sensor electrodes of the one or more sensorsand one or more sensor electrodes of the e-pen 2702.

The first test (test 1) corresponds to determining the e-pen NSEWmapping respect to the device, as shown by reference numeral 2750. Thesecond test (test 2) corresponds to determining the e-pen orientation(e.g., till, angle, etc.), As shown by reference numeral 2760.

Note that these different respective tests may be performed in a varietyof different manners. In various examples, the e-pen 2702, the touchsensor device with which the e-pen 2702 is configured to interact, orboth the e-pen and the touch sensor device are configured to facilitatethe test 1 and test 2.

For example, in one example, one or more processing modules associatedwith the e-pen 2702 is configured to facilitate both test 1 and test 2.In another example, one or more processing modules associated with thee-pen 2702 is configured to facilitate test 1, and one or moreprocessing modules associated with the touch sensor device is configuredto facilitate test 2. In yet another example, one or more processingmodules associated with the touch sensor device is configured tofacilitate test 1, and one or more processing modules associated withthe e-pen 2702 is configured to facilitate test 2. In yet anotherexample, one or more processing modules associated with the touch sensordevice is configured to facilitate both test 1 and test 2. In yetanother example, one or more processing modules associated with both thee-pen 2702 and the touch sensor device is configured to facilitate bothtest 1 and test 2. In general, any cooperation of one or more processingmodules associated with either the e-pen 2702 or the touch sensor devicemay be configured to facilitate test 1 and test 2.

As also described elsewhere herein with respect to other embodiments,examples, etc., note that different respective signals may be associatedwith the different respective electrodes (e.g., row and columnelectrodes) of the one or more touch sensors 2710 and the sensorelectrodes of the e-pen.

In general, the first test associated with the e-pen NSEW mappingdetermination corresponds to the determination of the respective sensorelectrodes of the e-pen 2702 with respect to the touchscreen. Forexample, this may involve determination of where on the touchscreen therespective signals from the sensor electrodes of the e-pen 2702 arebeing coupled into the sensor electrodes of the one or more touchsensors 2710.

When information corresponding to the assignment of signals to therespective sensor electrodes of the e-pen 2702 are known, then based ondetection of where those signals are being coupled into the touchscreenis determined, the mapping of the respective sensor electrodes of thee-pen 2702 with respect to the NSEW directionality of the touchscreenmay be determined.

Note that if the sensor electrode mapping with in the e-pen 2702 isunknown, testing may be performed including coupling a primary signalvia a primary sensor electrode of the e-pen 2702 to establish abase/reference location of the e-pen with respect to the touchscreen,and then one or more secondary signals may be coupled via one or moresecondary sensor electrodes of the e-pen 2702 to determine theorientation of the e-pen 2702 including where particularly the secondarysensor electrodes are located with respect to the touchscreen. Ifdesired in some embodiments, note that signals may be drivensimultaneously via to work more of the sensor electrodes of the e-pen2702 in accordance with making such determinations. In addition, notethat time multiplexed operation may be performed such that the firstsignal is preliminarily driven via the primary sensor electrode of thee-pen 2702, then a second signal is subsequently driven via a firstsecondary sensor electrode of the e-pen 2702, and so on such that onlyone particular signal is driven through one of the sensor electrodes ofthe e-pen 2702 at a given time in this testing procedure for the e-penNSEW mapping determination 2750. In such a case when only one particularsignal is driven through one of the sensor electrodes of the e-pen 2702at a given time, then differentiation between that signal and others maynot be needed. For example, when only one signal is operated a giventime, then differentiation between that signal may be obviated. However,when simultaneous operation is performed by driving more than one signalvia more than one sensor electrode of the e-pen 2702, differentiationbetween the respective signals will facilitate better performance andallow for simultaneous detection and processing. Note that thedifferentiation between the respective signals may be made using any ofthe various means described herein including frequency, amplitude, DCoffset, modulation, modulation & coding set/rate (MCS), forward errorcorrection (FEC) and/or error checking and correction (ECC), type, etc.

Note also that based on a signal is driven continually via the primarysensor electrode of the e-pen, and based on detection of that signalbeing coupled into the touchscreen, and based on knowledge of thephysical mapping of the secondary sensor electrodes within the e-pen2702, then by appropriately driving signals via the secondary sensorelectrodes of the e-pen in a known manner, accompanied with detection ofthose signals as they are being coupled into the touchscreen, willprovide for the e-pen NSEW mapping determination 2750.

With respect to the second test, the e-pen orientation determination2760, depending on the orientation, till, angle, etc. of the e-penrelative to the touchscreen service, there will be different capacitanceof the sensor electrodes of the e-pen 2702 with respect to the sensorelectrodes of the touchscreen. These different capacitances will resultin different degrees of capacitive coupling between signals that aretransmitted via the sensor electrodes of the e-pen 2702 to the sensorelectrodes of the touchscreen. Based on the e-pen NSEW mappingdetermination 2750, changes and differences of the capacitances betweenthe respective sensor electrodes of the e-pen 2702 as well as betweenthe sensor electrodes of the e-pen 2702 and the sensor electrodes of thetouchscreen may be detected based on the simultaneous driving andsensing of signals via these respective electrodes. Once again, note thecoupling of signals may be performed not only from the sensor electrodesof the e-pen 2702 to the sensor electrodes of the touchscreen, but alsofrom the sensor electrodes of the touchscreen to the sensor electrodesof the e-pen 2702.

The precision and capability of the simultaneous driving and sensing asmay be performed using DSCs as described herein and their equivalentsallows for highly accurate detection of particularly which signals arebeing coupled from the e-pen 2702 to the touchscreen, or vice versa, andalso the specific location via which that coupling is being made.

Various methods are described within certain of the following diagramsshowing different manners by which the test 1 and test 2 may beimplemented. In some examples, certain of the operations are performedusing an independent/smart e-pen and/or a dependent e-pen. In otherexamples, some of the operations are performed using anindependent/smart e-pen, while other of the operations are performedusing a dependent e-pen. In addition, note that there may be instancesin which a handshake, association, etc. between the e-pen and the touchsensor device is performed preliminarily, such as providing feedbackfrom one to the other, or vice versa, though for one or both of thetests is performed. For example, in an implementation in which one ormore processing modules associated with the e-pen is implemented toperform processing of the two tests, then, for example, for the firsttest, the e-pen receives some feedback from the touch sensor device ofat least one of the signals to be coupled from the touch sensor deviceto the e-pen. For example, when the e-pen is to perform identificationand processing of signals coupled from the touch sensor device to thee-pen, and based on the e-pen knowing the physical mapping of the sensorelectrodes of the e-pen, then the e-pen is then configured to receivethose signals and associated them with the physical mapping of thesensor electrodes of the e-pen, process that information in accordancewith performing the second step, and then transmit that determinedinformation back to the touch sensor device (e.g., via one or more ofthe sensor electrodes of the e-pen).

FIG. 28 is a schematic block diagram of another embodiment of a method2800 for execution by one or more devices in accordance with the presentinvention. The method 2800 operates in step 2810 by transmitting e-pensignals having different characteristic(s) via sensor electrodes ofe-pen (e.g., primary e-pen signal via primary sensor electrode,secondary signal(s) via one or more secondary sensor electrodes, erasuresignal(s) via one or more erasure sensor electrodes, etc.).

The method 2800 operates in step 2820 by detecting change(s) of e-pensignals having different characteristic(s) via sensor electrodes ofe-pen. note that this also included detection of any change(s) such asthose that may include affects caused by touch sensor signals. Themethod 2800 operates in step 2830 by transmitting touch sensor signalshaving different characteristic(s) via sensor electrodes of touchsensors (e.g., rows and columns sensor electrodes of touchscreen).

The method 2800 operates in step 2840 by detecting change(s) of touchsensor signals having different characteristic(s) via sensor electrodesof touch sensors (e.g., any change(s) include affects caused by e-pensignals). The method 2800 operates in step 2850 by processing thechange(s) of touch sensor signals having different characteristic(s) viasensor electrodes of touch sensors and/or change(s) of e-pen signalshaving different characteristic(s) via sensor electrodes of e-pen togenerate digital information corresponding to e-pen NSEW mapping ande-pen orientation.

Note that the operations depicted within the steps 2810 and 2820, 2830and 2840, may be performed in accordance with any of the variations,examples, embodiments, etc. of one or more DSCs as described herein thatis/are configured to perform simultaneous transmit and receipt ofsignals (simultaneous drive and detect of signals).

FIG. 29 is a schematic block diagram of another embodiment of a method2900 for execution by one or more devices in accordance with the presentinvention. The method 2900 operates in step 2910 by transmitting, viaprimary sensor electrode of e-pen, primary e-pen signal having primarycharacteristic(s) (e.g., primary e-pen signal via primary sensorelectrode 0). The method 2900 operates in step 2920 by transmitting, viaone or more secondary sensor electrodes of e-pen, one or more secondarye-pen signals having secondary characteristic(s) (e.g., first secondarye-pen signal via secondary sensor electrode 1, second secondary e-pensignal via secondary sensor electrode 2, etc.).

The method 2900 operates in step 2930 by detecting, via touch sensorelectrodes, the primary e-pen signal having primary characteristic(s).The method 2900 operates in step 2940 by identifying, using processingmodule(s) associated with the touch sensor electrodes, location of theprimary sensor electrode 0 (e.g., approx. cross-section where primarye-pen signal detected) and associated touch sensor electrodes.

The method 2900 operates in step 2950 by transmitting, via theassociated touch sensor electrodes, one or more touch sensor signalshaving touch sensor characteristic(s) (e.g., first touch sensor signalvia touch sensor electrode 1, second touch sensor signal via touchsensor electrode 2, etc.).

The method 2900 operates in step 2960 by detecting, via e-pen sensorelectrodes, the one or more touch sensor signals having touch sensorcharacteristic(s). The method 2900 operates in step 2970 by processing,using processing module(s) associated with the e-pen, the one or moretouch sensor signals having touch sensor characteristic(s) to generatedigital information corresponding to e-pen NSEW mapping and e-penorientation.

The method 2900 operates in step 2980 by detecting, via e-pen sensorelectrodes, change(s) of the e-pen signals (e.g., primary e-pen signaland the one or more secondary e-pen signals).

The method 2900 operates in step 2990 by processing, using processingmodule(s) associated with the e-pen, the change(s) of e-pen signals(e.g., primary e-pen signal and the one or more secondary e-pen signals)to generate digital information corresponding to e-pen orientation(e.g., tilt, orientation of e-pen changes capacitance between respectivesensor electrodes of e-pen).

FIG. 30 is a schematic block diagram of another embodiment of a method3000 for execution by one or more devices in accordance with the presentinvention. The method 3000 operates in step 3010 by transmitting, viaprimary sensor electrode of e-pen, primary e-pen signal having primarycharacteristic(s) (e.g., primary e-pen signal via primary sensorelectrode 0).

The method 3000 operates in step 3020 by transmitting, via one or moresecondary e-pen sensor electrodes, one or more secondary e-pen signalshaving secondary characteristic(s) (e.g., first secondary e-pen signalvia secondary sensor electrode 1, second secondary e-pen signal viasecondary sensor electrode 2, etc.).

The method 3000 operates in step 3030 by detecting, via electrodes oftouch sensors, the first e-pen signal having primary characteristic(s)and at least one of the one or more secondary e-pen signals havingsecondary characteristic(s).

The method 3000 operates in step 3040 by processing, using processingmodule(s) associated with the touch sensors, the primary e-pen signalhaving primary characteristic(s) and at least one of the one or moresecondary e-pen signals having secondary characteristic(s) to generatedigital information corresponding to e-pen NSEW mapping.

The method 3000 operates in step 3050 by identifying, using processingmodule(s) associated with the touch sensors, location of the primarysensor electrode based on the sensor electrodes of the touch sensors(e.g., row/column sensor electrodes) and associated touch sensorelectrodes (e.g., approx. cross-section of touch sensors where primaryfirst e-pen signal detected).

The method 3000 operates in step 3060 by transmitting, via theassociated touch sensor electrodes, one or more touch sensor signalshaving touch sensor characteristic(s) (e.g., first touch sensor signalvia touch sensor electrode 1, second touch sensor signal via touchsensor electrode 2, etc.).

The method 3000 operates in step 3070 by detecting, via the associatedtouch sensor electrodes, change(s) of the one or more touch sensorsignals.

The method 3000 operates in step 3080 by processing, using processingmodule(s) associated with the touch sensors, change(s) of the one ormore touch sensor signals to generate digital information correspondingto e-pen orientation (e.g., tilt, orientation of e-pen changescapacitance between respective sensor electrodes of e-pen).

FIG. 31 is a schematic block diagram of another embodiment of a method3100 for execution by one or more devices in accordance with the presentinvention. The method 3100 operates in step 3110 by transmitting, viaprimary e-pen sensor electrode, primary e-pen signal having primarycharacteristic(s) (e.g., primary e-pen signal via primary sensorelectrode 0).

The method 3100 operates in step 3120 by transmitting, via one or moresecondary e-pen sensor electrodes, one or more secondary e-pen signalshaving secondary characteristic(s) (e.g., first secondary e-pen signalvia secondary sensor electrode 1, second secondary e-pen signal viasecondary sensor electrode 2, etc.).

The method 3100 operates in step 3130 by detecting, via sensorelectrodes of e-pen, change(s) of e-pen signals (e.g., primary e-pensignal and one or more secondary e-pen signals) having differentcharacteristic(s).

The method 3100 operates in step 3140 by detecting, via electrodes oftouch sensors, the first e-pen signal having primary characteristic(s)and at least one of the one or more secondary e-pen signals havingsecondary characteristic(s).

The method 3100 operates in step 3150 by processing, using processingmodule(s) associated with the touch sensors, the primary e-pen signalhaving primary characteristic(s) and at least one of the one or moresecondary e-pen signals having secondary characteristic(s) to generatedigital information corresponding to e-pen NSEW mapping. The method 3100operates in step 3160 by processing, using processing module(s)associated with the e-pen, the change(s) of e-pen signals (e.g., primarye-pen signal and the one or more secondary e-pen signals) to generatedigital information corresponding to e-pen orientation (e.g., tilt,orientation of e-pen changes capacitance between respective sensorelectrodes of e-pen).

The method 3100 operates in step 3170 by transmitting, via one of thee-pen sensor electrodes and at least one of the sensor electrodes of thetouch sensors, one or more signals including the e-pen orientation tothe processing module(s) associated with the touch sensors.

Note that the operations depicted within the steps 3110 and 3120, and3130 and 3140, may be performed in accordance with any of thevariations, examples, embodiments, etc. of one or more DSCs as describedherein that is/are configured to perform simultaneous transmit andreceipt of signals (simultaneous drive and detect of signals).

FIG. 32A is a schematic block diagram of an embodiment 3201 of signalassignment to signals associated with e-pen sensor electrodes inaccordance with the present invention. In general, while certainembodiments, examples, etc. provided herein are described with respectto specific implementations of one or more e-pens (e.g., such thatdifferent respective signals are provided to different respective e-pensensor electrodes), note that, in general, such principles may beapplied to any system, computing device, device, etc. that includes morethan one sensor electrode that may be used for various applications(e.g., touch sensor, e-pen, etc.). For example, a user that isassociated with e-pen 3202 interacts with a touch sensor device thatincludes one or more touch sensors and that is configured to detect oneor more signals from one or more e-pens.

Operation within this diagram includes e-pen detection, as shown byreference numeral 3250, followed by signal assignment to the e-pensensor electrodes 3260, as shown by reference numeral 3260. Note thatthe e-pen detection is performed by a touch sensor device in someexamples. Note also that the signal assignment to the e-pen sensorelectrodes may be performed by the touch sensor device, by the e-pen, orcooperatively by both the touch sensor device and the e-pen in variousexamples.

In some examples, a handshake, association, etc. between the e-pen andthe touch sensor device is performed by which the e-pen 3202 is detectedby the touch sensor device, and one or more signals are assigned to theone or more sensor electrodes of the e-pen. In some examples, anassociation process is performed within a certain time period such as Xseconds (e.g., X=500 micro-seconds, 1 milli-seconds, etc.) that allowsthe touch sensor device and the e-pen to perform various operationsincluding assigning signal(s) to the sensor electrode(s) of the e-pen,learning which signal(s) are assigned to the sensor electrode(s) of thee-pen, etc.

Generally, any signal assignment may be performed to the respectivesensor electrodes of the e-pen 3202 based on signals having any of avariety of properties. In some examples, the signals are differentiatedbased on frequency. In other examples, they are differentiated based onone or more other characteristics including frequency, amplitude, DCoffset, modulation, modulation & coding set/rate (MCS), forward errorcorrection (FEC) and/or error checking and correction (ECC), type, etc.

In some examples, when time division multiplex operation is implemented,a given signal may be reused based on it being employed at differenttimes. In an example of operation and implementation, a signal isassigned to a first e-pen sensor electrode and is operative at or duringa first time period. Then, those same signal is assigned to a seconde-pen sensor electrodes and is operative at or during a second timeperiod.

Alternatively, a first signal is assigned to a first e-pen sensorelectrode, and a second signal that is differentiated from the firstsignal is assigned to a second e-pen sensor electrode, and both thefirst signal and the second signal operative at or during a first timeperiod. Then, those same signals is assigned to a third and fourth e-pensensor electrodes and are operative at or during a second time period.When time division multiplex operation is performed, one or more signalsmay be reused for different sensor electrodes at different times. Whensimultaneous operation is performed, differentiation between thedifferent respective signals assigned to the different sensor electrodesof the e-pen is performed. Examples of one or more characteristicsassociated with signals that may be assigned to sensor electrodes of thee-pen may include any one or more of frequency, amplitude, DC offset,modulation, modulation & coding set/rate (MCS), forward error correction(FEC) and/or error checking and correction (ECC), type, etc.

FIG. 32B is a schematic block diagram of an embodiment 3202 of frequencyassignment to signals associated with e-pen sensor electrodes inaccordance with the present invention. In this diagram, consider ausable frequency range of X Hz (where X may be any desired number andmay include frequencies ranging from DC to any frequency within theradio spectrum, such as the radio spectrum including 3 Hz to 3000 GHz/3THz, and the usable frequency range may be located anywhere within theradio spectrum and may optionally include DC). Generally speaking, sucha usable frequency range of X Hz may include any portion of anyfrequency spectrum via which signaling may be made (e.g., such asvarying from DC to any frequency within the radio spectrum, such asvarying from DC to frequencies at, near, or within the visible frequencyspectrum, etc.).

Within this usable frequency range, consider a number of particularfrequencies, shown as fc, fb, and so on up to fx. Based upon adetermination of which frequencies within the usable frequency range areavailable for use, they may be assigned to respective e-pen sensorelectrodes. Availability of a particular frequency may be determinedbased on a number of considerations including whether or not thatfrequency is being used by a touch sensor device, whether that frequencyis problematic such as being susceptible to noise, interference, etc.,and/or other considerations. In some examples, a first frequency that isdetermined to be susceptible to noise, interference, etc. is notselected or used, while a second frequency that is not determined to besusceptible to noise, interference, etc. is selected and used.

In an example of operation and implementation, one or more processingmodules 3230 is coupled to drive-sense circuits (DSCs) 28 that arerespectively coupled to one or more sensor electrodes. Note that the oneor more processing modules 3230 may include integrated memory and/or becoupled to other memory. At least some of the memory stores operationalinstructions to be executed by the one or more processing modules 3230.For example, the first DSC 28 is coupled to a primary sensor electrode(SE 0), a second DSC 20 is coupled to a first secondary electrode (SE1), and optionally one or more additional DSCs 28 is coupled to one ormore other sensor electrodes.

The one or more processing modules 3230 is configured to identify andperform assignment of different respective signals to the differentrespective sensor electrodes are it the identification and selection ofwhich signals are to be assigned to which sensor electrodes may bedynamic such that different assignments are made to the differentrespective sensor electrodes at different times. In certain instances,note that not all of the sensor electrodes have a signal assignedthereto. For example, fewer than all of the sensor electrodes may have asignal assigned to them at a given time.

Considering the example at the right-hand side of the diagram, signalassignment based on frequency is performed dynamically to the respectivee-pen sensor electrodes. For example, at or during time a, the frequencyfa is assigned to a primary sensor electrode 0 of the e-pen, thefrequency fe is assigned to a sensor electrode 1 of the e-pen, and so onas shown is that in the table of the diagram. Then, at or during time b,the frequency fx is assigned to a primary sensor electrode 0 of thee-pen, the frequency fd is assigned to a sensor electrode 1 of thee-pen, and so on as shown is that in the table of the diagram. Note thatthere may be instances in which a signal having the same frequency isassigned to the same sensor electrode at different times, while signalsassigned to another sensor electrode made change in frequency based onassignments made at different times.

Note that while this diagram provides an example of assignment ofsignals to different respective sensor electrodes of an e-pen based onfrequency of the signals, assignment of signals may be made to thedifferent respective sensor electrodes of the e-pen based on a number ofdifferent characteristics alternatively to frequency or in combinationwith frequency. Various examples are included herein including withrespect to the following diagrams illustrate assignment of differentrespective signals having different respective characteristics todifferent sensor electrodes of an e-pen. In some examples, theassignment is dynamic such that different respective signals havingdifferent characteristics are assigned to a given sensor electrode ofthe e-pen at different times.

FIG. 33A is a schematic block diagram of an embodiment 3301 of forwarderror correction (FEC)/error checking and correction (ECC) assignment tosignals associated with e-pen sensor electrodes in accordance with thepresent invention. This diagram shows adaptive encoding for differentrespective signal associated with different respective e-pen sensorelectrodes.

In this diagram, one or more processing modules 3330 (which may beimplemented to include memory and/or be coupled to memory) isimplemented to perform encoding processing using any one or more ofdifferent types of FEC codes or ECCs. The one or more processing modules3330 is configured to generate two or more encoded signals based on thevarious FEC codes or ECCs. In some examples, two or more encoded signalsare based on the same FEC code or ECC. In other examples, two or moreencoded signals are based on different FEC codes or ECCs. In thisexample, at or during a first time, the processor 3330 generates a firstencoded signal based on low density parity check (LDPC) code, and asecond encoded signal based on Reed-Solomon (RS) code. Generally, anynumber of additional encoded signals may be generated based on any oneor more FEC codes or ECCs (e.g., up to an nth encoded signal based onturbo code).

Note that these encoded signals subsequently are provided respective toone or more DSCs 28 that are in communication with one or more sensorelectrodes. In an example of operation and implementation, a firstencoded signal is provided via a first DSC 28 to a primary sensorelectrode (SE) 0. In some examples, this first encoded signal is an LDPCcoded signal. Also, a second encoded signal is provided via a second DSC28 to a secondary SE 1. In some examples, this second encoded signal isan RS coded signal. if desired in some embodiments, an nth (e.g., wheren is a positive integer greater than or equal to 3) encoded signal isprovided via an nth DSC 28 to another SE. In some examples, this nthencoded signal is a turbo coded signal.

FIG. 33B is a schematic block diagram of another embodiment 3302 ofFEC/ECC assignment to signals associated with e-pen sensor electrodes inaccordance with the present invention. The operations of this diagrammay be viewed as being at or during a different time than the first timeof FIG. 33A. Based on one or more considerations, the one or moreprocessing modules 3330 adapts one or more of the FEC codes or ECCs usedto generate the two or more encoded signals. For example, based on theone or more considerations, the one or more processing modules 3330selects different one or more FEC codes or ECCs to generate the two ormore encoded signals.

In an example of operation and implementation, at or during a secondtime, the one or more processing modules 3330 generates the firstencoded signal based on BCH (Bose and Ray-Chaudhuri, and Hocquenghem)code, the second encoded signal based on RS code, and an nth encodedsignal based on turbo code. Generally speaking adaptation betweendifferent FEC codes or ECCs may be made for the various encoded signalsat different times based on different criteria.

FIG. 34A is a schematic block diagram of an embodiment 3401 of differenttypes of modulations or modulation coding sets (MCSs) used formodulation of different bit or symbol streams. In this diagram,different types of modulations or modulation coding sets (MCSs) used formodulation of different bit or symbol streams. Information, data,signals, etc. may be modulated using various modulation codingtechniques. Examples of such modulation coding techniques may includebinary phase shift keying (BPSK), quadrature phase shift keying (QPSK)or quadrature amplitude modulation (QAM), 8-phase shift keying (PSK), 16quadrature amplitude modulation (QAM), 32 amplitude and phase shiftkeying (APSK), 64-QAM, etc., uncoded modulation, and/or any otherdesired types of modulation including higher ordered modulations thatmay include even greater number of constellation points (e.g., 1024 QAM,etc.).

Generally speaking, and considering a communication system typeimplementation including at least two devices (e.g., a transmittingdevice and a recipient device), a device that generates two or moretransmission streams based on different parameters can generate a firsttransmission stream based on a first at least one parameter such as afirst MCS that is relatively more robust and provides for relativelylower throughput than a second transmission stream based on a second atleast one parameter such as a second MCS that is relatively less robustand provides for relatively higher throughput. Relatively lower-orderedmodulation/MCS (e.g., relatively fewer bits per symbol, relatively fewerconstellation points per constellation, etc.) may be used for the firsttransmission stream to ensure reception by a recipient device and sothat the recipient device can successfully recover information therein(e.g., being relatively more robust, easier to demodulate, decode,etc.). Relatively higher-ordered modulation/MCS (e.g., relatively morebits per symbol, relatively more constellation points per constellation,etc.) may be used for the second transmission stream so that anyrecipient device that can successfully recover information there fromcan use it as well. This second information within the secondtransmission stream may be separate and independent from firstinformation included within the first transmission stream or may beintended for use in conjunction with the first information includedwithin the first transmission stream.

FIG. 34B is a schematic block diagram of an embodiment 3402 of differentlabeling of constellation points in a constellation. This diagramincludes an example of different labeling of constellation points in aconstellation. This diagram uses an example of a QPSK/QAM shapedconstellation having different labeling of the constellation pointstherein that may be used at different times. In an example operation, adevice generates a transmission stream based on the labeling 1 at orduring a first time and based on the labeling 2 at or during a secondtime. The particular labeling of constellation points within aconstellation is one example of a parameter that may be used to generatea transmission stream and that may change and vary over time.

FIG. 34C is a schematic block diagram of an embodiment 3403 of differentarrangements of constellation points in a type of constellation. Thisdiagram includes different arrangements of constellation points in atype of constellation. This diagram also uses an example of a QPSK/QAMshaped constellation but with varying placement of the fourconstellation points based on different forms of QPSK (e.g., QPSK1,QPSK2, and QPSK3). Note that the relative distance of the fourconstellation points may be scaled differently at different times, yetsuch that each constellation point is included within a separatequadrant. Comparing QPSK2 to QPSK1, the constellation points of QPSK2are relatively further from the origin than QPSK1. Comparing QPSK3 toQPSK2, the constellation points of QPSK3 are shifted up or down relativeto QPSK2.

Note that any other type of shape of constellation may similarly bevaried based on the principles described with respect to FIG. 34B andFIG. 34C. For example, the labeling and or placement of theconstellation points within an 8-PSK type constellation, a 16 QAM typeconstellation, and/or any other type constellation may change in very asa function of time based on any desired consideration as well.

FIG. 34D is a schematic block diagram of an embodiment 3404 of adaptivesymbol mapping/modulation for different transmission streams. Thisdiagram includes adaptive symbol mapping/modulation for differenttransmission streams. In this diagram, one or more processing modules3430 of a device is/are implemented to perform symbol mapping ormodulation based on different modulations, symbol mappings, MCSs, etc.at or during different times. In some examples, two or more encodedstreams are based on the same modulation, symbol mapping, MCS, etc. Inother examples, two or more encoded streams are based on differentmodulations, symbol mappings, MCSs, etc. In this example, at or during afirst time, the one or more processing modules 3430 generates a firstsymbol stream based on a first QAM/QPSK mode (e.g., QPSK1 of FIG. 34C)and a second symbol stream based on a second QAM/QPSK mode (e.g., QPSK2of FIG. 34C). Generally, any number of additional symbol streams may begenerated based on any one or more modulations, symbol mappings, MCSs,etc. (e.g., up to an nth symbol stream based on 16 QAM).

In an example of operation and implementation, a first signal having afirst modulation provided via a first DSC 28 to a primary SE 0. In someexamples, this first modulated signal is a 1^(st) QAM signal (e.g.,QAM1/QPSK1). Also, a second signal is provided via a second DSC 28 to asecondary SE 1. In some examples, this second signal is a 2^(nd) QAMsignal (e.g., QAM2/QPSK2). if desired in some embodiments, an nth (e.g.,where n is a positive integer greater than or equal to 3) signal isprovided via an nth DSC 28 to another SE. In some examples, this nthencoded signal is a 16 QAM signal.

In general, note that any number, type, etc. of various modulationsand/or MCSs may be implemented and used by the one or more processingmodules 3430. Also, note that characteristics of a particular type ofmodulation may be varied to generate different variants of a common typeof modulation (e.g., using different constellation pointlabeling/mapping such as with respect to FIG. 34B as applied for QPSKand such principles may be applied to any type, shape, etc. modulation,differently located constellation points such as with respect to FIG.34E as applied for QPSK and such principles may be applied to any type,shape, etc. modulation, etc.)

In addition, note that alternative forms of modulation may be used suchas frequency-shift keying (FSK) (e.g., a frequency modulation schemeusing discrete frequency changes of a carrier signal/wave in accordancewith a frequency modulation, a simplest form of which is binary FSKusing a pair of frequencies corresponding to binary information [e.g.,first frequency for transmitting 0s and second frequency fortransmitting 1s], such a scheme may be used in a continuous time, veryfast signaling approach, such as in a multi-frequency analog system, inwhich multiple continuous transmission may be performed over carrier(s),etc.), multiple frequency-shift keying (MFSK) (e.g., a variant of FSKusing two or more frequency, e.g., such as being an M-ary orthogonalmodulation, where M is a positive integer), amplitude-shift keying (ASK)(e.g., an amplitude modulation implemented to represent digital databased on changes of the amplitude in a carrier signal/wave), etc. and/orany other form of analog modulation, digital modulation, hierarchicalmodulation, etc.

FIG. 34E is a schematic block diagram of an embodiment 3405 of adaptivesymbol mapping/modulation for different transmission streams. Thisdiagram includes adaptive symbol mapping/modulation for differenttransmission streams. The operations of this diagram may be viewed asbeing at or during a different time than the first time of FIG. 34D.Based on one or more considerations, the one or more processing module3430 adapts one or more of the modulations, symbol mappings, MCSs, etc.used to generate the two or more symbol streams. For example, based onfeedback provided from a recipient device to which the two or moreencoded streams of FIG. 6D have been transmitted, the one or moreprocessing module 3430 selects different one or more modulations, symbolmappings, MCSs, etc. to generate the two or more symbol streams. In thisexample, at or during a second time, the one or more processing module3430 generates the first symbol stream based on 16 QAM, the secondsymbol stream based on 64 QAM, and optional an nth symbol stream basedon 256 QAM.

In an example of operation and implementation, at or during a secondtime, the one or more processing modules 3430 generates a first symbolstream based on 16 QAM and a second symbol stream based on 64 QAM.Generally, any number of additional symbol streams may be generatedbased on any one or more modulations, symbol mappings, MCSs, etc. (e.g.,up to an nth symbol stream based on 256 QAM).

FIG. 35 is a schematic block diagram of another embodiment of a method3500 for execution by one or more devices in accordance with the presentinvention. The method 3500 begins in step 3510 by monitoring for ane-pen. In some examples, this is performed using a touch sensor device.For example, one or more processing modules implemented within a touchsensor device or operative with the touch sensor device is configured toperform processing of signals associated with monitoring for the e-pen.For example, the one or more processing modules is configured to performmonitoring for one or more signals being coupled from one or more sensorelectrodes of an e-pen to the row and column electrodes of thetouchscreen.

Then, based on no detection of an e-pen in step 3520, the method 3500loops back to the step 3510 to continue monitoring for an e-pen.Alternatively, based on detection of an e-pen in step 3520, the method3500 branches to step 3530 and operates by determining signalavailability. For example, the determination of signal availability maybe made based upon a variety of considerations. In some examples, one ormore signal characteristics (e.g., frequency, amplitude, DC offset,modulation, modulation & coding set/rate (MCS), forward error correction(FEC) and/or error checking and correction (ECC), type, etc.) of one ormore signals being used is considered and is the basis, at least inpart, by which signal availability is determined. In other examples, oneor more signals not being used by one or more e-pens and/or the touchsensor device is the basis, at least in part, by which signalavailability is determined. Generally speaking, signal availabilitydetermination is based on determining which signals may be available tobe used within the system. For example, those signals that are notcurrently being used and are available may be selected and used for oneor more purposes.

The method 3500 also operates in step 3540 by assigning one or moresignals to e-pen sensor electrodes based on the signal availability thatis determined. For example, in an implementation in which the e-pen doesnot have specific signals already assigned and associated with the e-pensensor electrodes therein, dynamic assignment of one or more signals,among those signals that are available, may be made to the e-pen sensorelectrodes. This assigning operation is performed by the touch sensordevice and is communicated to the e-pen. The method 3500 also operatesin step 3550 by operating the e-pen and/or the touch sensor device basedon the assigned signals.

This method 3500 provides a means by which different respective signalsmay be assigned for various purposes within an e-pen and touch sensordevice system based on signal availability. Note that adaptation andreassignment of signals may be made at different times and based onvarious considerations. For example, based on a determination thatoperation using a first one or more assigned signals comparesunfavorably to one or more performance criteria (e.g., poor performance,noise, noisy signaling, interference, latency, etc.), then differentassignment of signals may be made for subsequent operation of the e-penand/or the touch sensor device.

FIG. 36 is a schematic block diagram of another embodiment of a method3600 for execution by one or more devices in accordance with the presentinvention. The method 3600 operates in step 3610 by monitoring for apredetermined signal of an e-pen. For example, the predetermined signalmay be a signal having any one or more predetermined characteristicssuch as frequency, amplitude, DC offset, modulation, modulation & codingset/rate (MCS), forward error correction (FEC) and/or error checking andcorrection (ECC), type, etc.

Based on no detection of the predetermined signal in step 3620, themethod 3600 loops back to step 3610 to continue monitoring for thepredetermined signal. Alternatively, based on detection of thepredetermined signal in step 3620 this method 3600 branches to step 3630and operates by processing the predetermined signal to determine whetheran e-pen associated with the predetermined signal is an independente-pen. Examples of different types of e-pens include independent e-pensand dependent e-pens. Generally speaking, an independent e-pen may beviewed as an e-pen that is a smart e-pen and that includes intelligenceand associated processing capability therein. In some examples, anindependent e-pen includes one or more processing modules that mayinclude integrated memory and/or be coupled to other memory. At leastsome of the memory stores operational instructions to be executed by theone or more processing modules. Generally speaking, a dependent e-penmay be viewed as an e-pen the that is not a smart e-pen and that doesnot include intelligence and associated processing capability therein.

Based on a determination that the e-pen is an independent e-pen in step3640, the method 3600 branches to perform various operations associatedwith independent e-pen/smart e-pen operation. For example, determinationof formatting of information to be provided via communications betweenthe e-pen and the touch sensor device is made. For example, the method3600 operates in step 3680 by coordinating formatting for e-pen/touchsensor device communications. Examples of formatting information relatedto communications between the e-pen and the touch sensor device mayinclude any one or more of packet type, format, header format, payload,body, size, length, modulation, FEC/ECC, etc. Such determination mayinclude the number of bits or bytes of the packet (e.g., 4-bits,16-bits, etc.), the number of bits or bytes of various portions of thepacket including different respective fields, information related tointerpretation of the respective fields of packet used in thosecommunication, etc.

Details regarding the type of communications provided between the e-penand the touch sensor device may be performed in a variety of ways. Inone example, they are determined independently by an independent e-penand communicated to the touch sensor device. In another example, theyare determined cooperatively by both the touch sensor device and theindependent e-pen. For example, this may be performed based on ahandshake between the e-pen and the touch sensor device.

When operating based on this path of the method 3600, the method 3600also operates in step 3684 by determining signal availability. Thisavailability is performed by an independent e-pen or cooperatively usingthe touch sensor device and the independent e-pen. The signalavailability is based on a number of factors as described hereinincluding information regarding those signals already assigned to or inuse by the touch sensor device, favorable or unfavorable comparison toone or more performance criteria (e.g., poor performance, noise, noisysignaling, interference, latency, etc.), etc. Then, based on one or moresignals being available for use, the method 3600 operates in step 3684by assigning one or more of those signals to the one or more e-pensensor electrodes. This assigning operation is performed by anindependent e-pen or cooperatively using the touch sensor device and theindependent e-pen.

Alternatively, based on a determination that the e-pen is a dependente-pen in step 3640, the method 3600 branches to step 3650 and operatesby determining signal availability. For example, the determination ofsignal availability may be made based upon a variety of considerations.In some examples, one or more signal characteristics (e.g., frequency,amplitude, DC offset, modulation, modulation & coding set/rate (MCS),forward error correction (FEC) and/or error checking and correction(ECC), type, etc.) of one or more signals being used is considered andis the basis, at least in part, by which signal availability isdetermined. In other examples, one or more signals not being used by oneor more e-pens and/or the touch sensor device is the basis, at least inpart, by which signal availability is determined. Generally speaking,signal availability determination is based on determining which signalsmay be available to be used within the system. For example, thosesignals that are not currently being used and are available may beselected and used for one or more purposes.

The method 3600 also operates in step 3660 by assigning one or moresignals to e-pen sensor electrodes based on the signal availability thatis determined. For example, in an implementation in which the e-pen doesnot have specific signals already assigned and associated with the e-pensensor electrodes therein, dynamic assignment of one or more signals,among those signals that are available, may be made to the e-pen sensorelectrodes. This assigning operation is performed by the touch sensordevice and is communicated to the dependent e-pen. The method 3600 alsooperates in step 3670 by operating the e-pen and/or the touch sensordevice based on the assigned signals.

FIG. 37 is a schematic block diagram of another embodiment of a method3700 for execution by one or more devices in accordance with the presentinvention. The method 3700 begins in step 3710 by monitoring for ane-pen. In some examples, this is performed using a touch sensor device.For example, one or more processing modules implemented within a touchsensor device or operative with the touch sensor device is configured toperform processing of signals associated with monitoring for the e-pen.For example, the one or more processing modules is configured to performmonitoring for one or more signals being coupled from one or more sensorelectrodes of an e-pen to the row and column electrodes of thetouchscreen.

Then, based on no detection of an e-pen in step 3720, the method 3700loops back to the step 3710 to continue monitoring for an e-pen.Alternatively, based on detection of an e-pen in step 3720, the method3700 branches to step 3730 and operates by processing the e-pen signalthat is detected to determine whether the e-pen signal corresponds towrite or erase operation. For example, based on assignment of differentrespective signals to different respective sensor electrodes of ane-pen, detection, processing, and analysis of a signal will provideinformation regarding whether or not the e-pen signal corresponds towrite or erase operation. For example, different respective sensorelectrodes of an e-pen are implemented for various operation includingwrite and/or erase operation. When a signal is detected, and that signalcorresponds to a sensor electrode of the e-pen implemented for writeoperation, then the e-pen signal is determined to correspond to writeoperation. Alternatively, when a signal is detected, and that signalcorresponds to a sensor electrode of the e-pen implemented for readoperation, then the e-pen signal is determined to correspond to readoperation.

The method 3700 continues via step 3740 and branches to step 3750 byprocessing the e-pen signal based on write operation based on adetermination that the e-pen signal corresponds to write operation. Themethod 3700 continues via step 3740 and step 3760 and branches to step3760 by processing the e-pen signal based on erase operation based on adetermination that the e-pen signal corresponds to erase operation.

Alternatively, based on a failure to determine whether the e-pen signalcorresponds to write or erase operation, the method 3700 continues viastep 3740 and step 3760 and ends. In an alternative implementation, themethod 3700 continues via step 3740 and step 3760 and loops back to thestep 3710 or the step 3730 to continue monitoring foreign e-pen signal(step 3710) or alternatively processing that e-pen signal to determinewhether the e-pen signal corresponds to write or erase operation (step3730). For example, a failure in processing of the e-pen signal mayresult in a failure to perform proper identification of the e-pen signalcorresponding to write or erase operation. Additional processing,reprocessing, etc. of the e-pen signal may result in properdetermination of the correspondence of the e-pen signal.

In some alternative embodiments of the various methods, systems,devices, etc. described herein, note that all touch sensing relatedprocessing is performed using the one or more processing modulesincluded within a sensor device or associated with the touch sensordevice, and all e-pen related processing is performed using one or moreprocessing modules of the e-pen or that are associated with the e-pen.

In other alternative embodiments of the various methods, systems,devices, etc. described herein, note that all touch sensing relatedprocessing as well as e-pen related processing is performed using theone or more processing modules included within a sensor device orassociated with the touch sensor device.

In yet other alternative embodiments of the various methods, systems,devices, etc. described herein, note that all touch sensing relatedprocessing as well as e-pen related processing is performed using theone or more processing modules of the e-pen or that are associated withthe e-pen.

In further alternative embodiments of the various methods, systems,devices, etc. described herein, note that the touch sensing relatedprocessing and the e-pen related processing is distributed among one ormore processing modules included within a sensor device or associatedwith the touch sensor device and/or one or more processing modules ofthe e-pen or that are associated with the e-pen (e.g., in a hybridimplementation in which some processing for each of the touch sensingrelated processing and the e-pen related processing is performed in adistributed manner involving one or both of one or more processingmodules corresponding to the touch sensor device and/or the e-pen).

In addition, note that the functionality, methods, operations,capability, etc. described in associated with the various embodiments,examples, etc. and/or their equivalents may be performed in a variety ofdifferent ways. In certain limitations, one or more processing modulesis/are coupled to one or more drive-sense circuits (DSCs). Note that theone or more processing modules may include integrated memory and/or becoupled to other memory. At least some of the memory stores operationalinstructions to be executed by the one or more processing modules. Insome examples, one or more of the DSCs generates digital informationcorresponding to one or more signals being simultaneously transmittedand sensed to one or more elements (e.g., such as to e-pen sensorelectrodes, touch sensor electrodes, etc. and via single respectivelines via which both transmission and sensing is performedsimultaneously).

Note that such one or more processing modules may also be incommunication with and interact with one or more other elements in agiven implementation. For example, one or more processing modules may bein communication with one or more other processing modules via variouscommunication means (e.g., communication links, communication networks,etc.). Certain of the various functionality, methods, operations,capability, etc. described in associated with the various embodiments,examples, etc. and/or their equivalents as described herein may beimplemented using appropriately connected one or more processingmodules, DSCs, sensors (e.g., such as e-pen sensor electrodes, touchsensor electrodes, etc.). The one or more processing modules isconfigured to process one or more digital signals, provided from the oneor more DSCs, that a representative of one or more electricalcharacteristics of the one or more elements of via which one or moresignals are simultaneously driven and sensed (simultaneously transmittedand received) from the one or more DSCs.

For example, considering a physical imitation in which one or moreprocessing modules is in communication with one or more DSCs that are incommunication with one or more e-pen sensor electrodes, touch sensorelectrodes, sensors, transducers, etc., appropriate operation of the oneor more DSCs, such as may be directed by the one or more processingmodules or cooperatively performed with the one or more processingmodules, facilitates implementation of various embodiments, examples,etc. and/or their equivalents as described herein.

It is noted that terminologies as may be used herein such as bit stream,stream, signal sequence, etc. (or their equivalents) have been usedinterchangeably to describe digital information whose contentcorresponds to any of a number of desired types (e.g., data, video,speech, text, graphics, audio, etc. any of which may generally bereferred to as ‘data’).

As may be used herein, the terms “substantially” and “approximately”provide an industry-accepted tolerance for its corresponding term and/orrelativity between items. For some industries, an industry-acceptedtolerance is less than one percent and, for other industries, theindustry-accepted tolerance is 10 percent or more. Other examples ofindustry-accepted tolerance range from less than one percent to fiftypercent. Industry-accepted tolerances correspond to, but are not limitedto, component values, integrated circuit process variations, temperaturevariations, rise and fall times, thermal noise, dimensions, signalingerrors, dropped packets, temperatures, pressures, material compositions,and/or performance metrics. Within an industry, tolerance variances ofaccepted tolerances may be more or less than a percentage level (e.g.,dimension tolerance of less than +/−1%). Some relativity between itemsmay range from a difference of less than a percentage level to a fewpercent. Other relativity between items may range from a difference of afew percent to magnitude of differences.

As may also be used herein, the term(s) “configured to”, “operablycoupled to”, “coupled to”, and/or “coupling” includes direct couplingbetween items and/or indirect coupling between items via an interveningitem (e.g., an item includes, but is not limited to, a component, anelement, a circuit, and/or a module) where, for an example of indirectcoupling, the intervening item does not modify the information of asignal but may adjust its current level, voltage level, and/or powerlevel. As may further be used herein, inferred coupling (i.e., where oneelement is coupled to another element by inference) includes direct andindirect coupling between two items in the same manner as “coupled to”.

As may even further be used herein, the term “configured to”, “operableto”, “coupled to”, or “operably coupled to” indicates that an itemincludes one or more of power connections, input(s), output(s), etc., toperform, when activated, one or more its corresponding functions and mayfurther include inferred coupling to one or more other items. As maystill further be used herein, the term “associated with”, includesdirect and/or indirect coupling of separate items and/or one item beingembedded within another item.

As may be used herein, the term “compares favorably”, indicates that acomparison between two or more items, signals, etc., provides a desiredrelationship. For example, when the desired relationship is that signal1 has a greater magnitude than signal 2, a favorable comparison may beachieved when the magnitude of signal 1 is greater than that of signal 2or when the magnitude of signal 2 is less than that of signal 1. As maybe used herein, the term “compares unfavorably”, indicates that acomparison between two or more items, signals, etc., fails to providethe desired relationship.

As may be used herein, one or more claims may include, in a specificform of this generic form, the phrase “at least one of a, b, and c” orof this generic form “at least one of a, b, or c”, with more or lesselements than “a”, “b”, and “c”. In either phrasing, the phrases are tobe interpreted identically. In particular, “at least one of a, b, and c”is equivalent to “at least one of a, b, or c” and shall mean a, b,and/or c. As an example, it means: “a” only, “b” only, “c” only, “a” and“b”, “a” and “c”, “b” and “c”, and/or “a”, “b”, and “c”.

As may also be used herein, the terms “processing module”, “processingcircuit”, “processor”, “processing circuitry”, and/or “processing unit”may be a single processing device or a plurality of processing devices.Such a processing device may be a microprocessor, micro-controller,digital signal processor, microcomputer, central processing unit, fieldprogrammable gate array, programmable logic device, state machine, logiccircuitry, analog circuitry, digital circuitry, and/or any device thatmanipulates signals (analog and/or digital) based on hard coding of thecircuitry and/or operational instructions. The processing module,module, processing circuit, processing circuitry, and/or processing unitmay be, or further include, memory and/or an integrated memory element,which may be a single memory device, a plurality of memory devices,and/or embedded circuitry of another processing module, module,processing circuit, processing circuitry, and/or processing unit. Such amemory device may be a read-only memory, random access memory, volatilememory, non-volatile memory, static memory, dynamic memory, flashmemory, cache memory, and/or any device that stores digital information.Note that if the processing module, module, processing circuit,processing circuitry, and/or processing unit includes more than oneprocessing device, the processing devices may be centrally located(e.g., directly coupled together via a wired and/or wireless busstructure) or may be distributedly located (e.g., cloud computing viaindirect coupling via a local area network and/or a wide area network).Further note that if the processing module, module, processing circuit,processing circuitry and/or processing unit implements one or more ofits functions via a state machine, analog circuitry, digital circuitry,and/or logic circuitry, the memory and/or memory element storing thecorresponding operational instructions may be embedded within, orexternal to, the circuitry comprising the state machine, analogcircuitry, digital circuitry, and/or logic circuitry. Still further notethat, the memory element may store, and the processing module, module,processing circuit, processing circuitry and/or processing unitexecutes, hard coded and/or operational instructions corresponding to atleast some of the steps and/or functions illustrated in one or more ofthe Figures. Such a memory device or memory element can be included inan article of manufacture.

One or more embodiments have been described above with the aid of methodsteps illustrating the performance of specified functions andrelationships thereof. The boundaries and sequence of these functionalbuilding blocks and method steps have been arbitrarily defined hereinfor convenience of description. Alternate boundaries and sequences canbe defined so long as the specified functions and relationships areappropriately performed. Any such alternate boundaries or sequences arethus within the scope and spirit of the claims. Further, the boundariesof these functional building blocks have been arbitrarily defined forconvenience of description. Alternate boundaries could be defined aslong as the certain significant functions are appropriately performed.Similarly, flow diagram blocks may also have been arbitrarily definedherein to illustrate certain significant functionality.

To the extent used, the flow diagram block boundaries and sequence couldhave been defined otherwise and still perform the certain significantfunctionality. Such alternate definitions of both functional buildingblocks and flow diagram blocks and sequences are thus within the scopeand spirit of the claims. One of average skill in the art will alsorecognize that the functional building blocks, and other illustrativeblocks, modules and components herein, can be implemented as illustratedor by discrete components, application specific integrated circuits,processors executing appropriate software and the like or anycombination thereof.

In addition, a flow diagram may include a “start” and/or “continue”indication. The “start” and “continue” indications reflect that thesteps presented can optionally be incorporated in or otherwise used inconjunction with one or more other routines. In addition, a flow diagrammay include an “end” and/or “continue” indication. The “end” and/or“continue” indications reflect that the steps presented can end asdescribed and shown or optionally be incorporated in or otherwise usedin conjunction with one or more other routines. In this context, “start”indicates the beginning of the first step presented and may be precededby other activities not specifically shown. Further, the “continue”indication reflects that the steps presented may be performed multipletimes and/or may be succeeded by other activities not specificallyshown. Further, while a flow diagram indicates a particular ordering ofsteps, other orderings are likewise possible provided that theprinciples of causality are maintained.

The one or more embodiments are used herein to illustrate one or moreaspects, one or more features, one or more concepts, and/or one or moreexamples. A physical embodiment of an apparatus, an article ofmanufacture, a machine, and/or of a process may include one or more ofthe aspects, features, concepts, examples, etc. described with referenceto one or more of the embodiments discussed herein. Further, from figureto figure, the embodiments may incorporate the same or similarly namedfunctions, steps, modules, etc. that may use the same or differentreference numbers and, as such, the functions, steps, modules, etc. maybe the same or similar functions, steps, modules, etc. or differentones.

Unless specifically stated to the contra, signals to, from, and/orbetween elements in a figure of any of the figures presented herein maybe analog or digital, continuous time or discrete time, and single-endedor differential. For instance, if a signal path is shown as asingle-ended path, it also represents a differential signal path.Similarly, if a signal path is shown as a differential path, it alsorepresents a single-ended signal path. While one or more particulararchitectures are described herein, other architectures can likewise beimplemented that use one or more data buses not expressly shown, directconnectivity between elements, and/or indirect coupling between otherelements as recognized by one of average skill in the art.

The term “module” is used in the description of one or more of theembodiments. A module implements one or more functions via a device suchas a processor or other processing device or other hardware that mayinclude or operate in association with a memory that stores operationalinstructions. A module may operate independently and/or in conjunctionwith software and/or firmware. As also used herein, a module may containone or more sub-modules, each of which may be one or more modules.

As may further be used herein, a computer readable memory includes oneor more memory elements. A memory element may be a separate memorydevice, multiple memory devices, or a set of memory locations within amemory device. Such a memory device may be a read-only memory, randomaccess memory, volatile memory, non-volatile memory, static memory,dynamic memory, flash memory, cache memory, and/or any device thatstores digital information. The memory device may be in a form asolid-state memory, a hard drive memory, cloud memory, thumb drive,server memory, computing device memory, and/or other physical medium forstoring digital information.

While particular combinations of various functions and features of theone or more embodiments have been expressly described herein, othercombinations of these features and functions are likewise possible. Thepresent disclosure is not limited by the particular examples disclosedherein and expressly incorporates these other combinations.

What is claimed is:
 1. A system including an electronic pen (e-pen) anda touch sensor device comprising: the e-pen including: an e-pen sensorelectrode; and a first drive-sense circuit (DSC) operably coupled to thee-pen sensor electrode, wherein, when enabled, the first DSC configuredto drive an e-pen signal having a first frequency via a first singleline coupling to the e-pen sensor electrode, wherein based oninteraction of the e-pen with the touch sensor device, the e-pen signalis coupled into a touch sensor electrode of the touch sensor device; andthe touch sensor device including a second DSC operably coupled to thetouch sensor electrode of the touch sensor device, wherein, whenenabled, the second DSC configured to: drive a touch sensor signalhaving a second frequency via a second single line coupling to the touchsensor electrode of the touch sensor device and simultaneously sense,via the second single line, change of the touch sensor signal includingsensing the e-pen signal coupled from the e-pen sensor electrode intothe touch sensor electrode of the touch sensor device; and process thechange of the touch sensor signal to generate a digital signal that isrepresentative of an electrical characteristic of the touch sensorelectrode.
 2. The system of claim 1, wherein, when enabled, the firstDSC of the e-pen configured to: drive the e-pen signal having the firstfrequency via the first single line coupling to the e-pen sensorelectrode and simultaneously sense, via the first single line, change ofthe e-pen signal; and process the change of the e-pen signal to generateanother digital signal that is representative of an electricalcharacteristic of the e-pen sensor electrode.
 3. The system of claim 2,wherein the e-pen further comprising: a memory that stores operationalinstructions; and a processing module operably coupled to the first DSCand to the memory, wherein, when enabled, the processing moduleconfigured to execute the operational instructions to process theanother digital signal to detect the interaction of the e-pen with thetouch sensor device.
 4. The system of claim 1, wherein the touch sensordevice further comprising: a memory that stores operationalinstructions; and a processing module operably coupled to the second DSCand to the memory, wherein, when enabled, the processing moduleconfigured to execute the operational instructions to process thedigital signal to detect the interaction of the e-pen with the touchsensor device.
 5. The system of claim 1, wherein the e-pen is tetheredto the touch sensor device, and the first DSC is powered by the touchsensor device.
 6. The system of claim 1, wherein the e-pen is a wirelesse-pen.
 7. The system of claim 1, wherein the second DSC furthercomprising: a power source circuit operably coupled to the touch sensorelectrode via the second single line, wherein, when enabled, the powersource circuit configured to provide the touch sensor signal thatincludes an analog signal via the second single line coupling to thetouch sensor electrode, and wherein the analog signal includes at leastone of a DC (direct current) component or an oscillating component; anda power source change detection circuit operably coupled to the powersource circuit, wherein, when enabled, the power source change detectioncircuit is configured to: detect an effect on the analog signal that isbased on the electrical characteristic of the touch sensor electrode;and generate the digital signal that is representative of the electricalcharacteristic of the touch sensor electrode.
 8. The system of claim 7,wherein the second DSC further comprising: the power source circuitincluding a power source to source at least one of a voltage or acurrent to the touch sensor electrode via the second single line; andthe power source change detection circuit including: a power sourcereference circuit configured to provide at least one of a voltagereference or a current reference; and a comparator configured to comparethe at least one of the voltage and or the current provided to the touchsensor electrode to the at least one of the voltage reference or thecurrent reference, respectively, to produce the analog signal.
 9. Asystem including an electronic pen (e-pen) and a touch sensor devicecomprising: the e-pen operably coupled and configured to drive an e-pensignal having a first frequency to an e-pen sensor electrode of thee-pen, wherein based on interaction of the e-pen with the touch sensordevice, the e-pen signal is coupled from the e-pen sensor electrode ofthe e-pen into a touch sensor electrode of the touch sensor device; andthe touch sensor device including a drive-sense circuit (DSC) operablycoupled to the touch sensor electrode of the touch sensor device,wherein, when enabled, the DSC configured to: drive a touch sensorsignal having a second frequency via a single line coupling to the touchsensor electrode of the touch sensor device and simultaneously sense,via the single line, change of the touch sensor signal including sensingthe e-pen signal coupled from the e-pen sensor electrode into the touchsensor electrode of the touch sensor device; and process the change ofthe touch sensor signal to generate a digital signal that isrepresentative of an electrical characteristic of the touch sensorelectrode.
 10. The system of claim 9, wherein the e-pen furthercomprising: another DSC operably coupled to the e-pen sensor electrodeof the e-pen, wherein, when enabled, the another DSC configured to drivethe e-pen signal having the first frequency via another single linecoupling to the e-pen sensor electrode of the e-pen.
 11. The system ofclaim 9, wherein the touch sensor device further comprising: a memorythat stores operational instructions; and a processing module operablycoupled to the DSC and to the memory, wherein, when enabled, theprocessing module configured to execute the operational instructions toprocess the digital signal to detect the interaction of the e-pen withthe touch sensor device.
 12. The system of claim 9, wherein the e-pen isa wireless e-pen.
 13. The system of claim 9, wherein the DSC furthercomprising: a power source circuit operably coupled to the touch sensorelectrode via the single line, wherein, when enabled, the power sourcecircuit configured to provide the touch sensor signal that includes ananalog signal via the single line coupling to the touch sensorelectrode, and wherein the analog signal includes at least one of a DC(direct current) component or an oscillating component; and a powersource change detection circuit operably coupled to the power sourcecircuit, wherein, when enabled, the power source change detectioncircuit is configured to: detect an effect on the analog signal that isbased on the electrical characteristic of the touch sensor electrode;and generate the digital signal that is representative of the electricalcharacteristic of the touch sensor electrode.
 14. The system of claim13, wherein the DSC further comprising: the power source circuitincluding a power source to source at least one of a voltage or acurrent to the touch sensor electrode via the single line; and the powersource change detection circuit including: a power source referencecircuit configured to provide at least one of a voltage reference or acurrent reference; and a comparator configured to compare the at leastone of the voltage and or the current provided to the touch sensorelectrode to the at least one of the voltage reference or the currentreference, respectively, to produce the analog signal.
 15. A systemincluding an electronic pen (e-pen) and a touch sensor devicecomprising: the e-pen operably coupled and configured to drive an e-pensignal having a first frequency, wherein based on interaction of thee-pen with the touch sensor device, the e-pen signal is coupled into atouch sensor electrode of the touch sensor device; and the touch sensordevice including a drive-sense circuit (DSC) operably coupled to thetouch sensor electrode of the touch sensor device, wherein, whenenabled, the DSC configured to: drive a touch sensor signal having asecond frequency via a single line coupling to the touch sensorelectrode of the touch sensor device and simultaneously sense, via thesingle line, change of the touch sensor signal including sensing thee-pen signal coupled from the e-pen into the touch sensor electrode ofthe touch sensor device; and process the change of the touch sensorsignal to generate a digital signal that is representative of anelectrical characteristic of the touch sensor electrode.
 16. The systemof claim 15, wherein the e-pen further comprising: another DSC operablycoupled to an e-pen sensor electrode of the e-pen, wherein, whenenabled, the another DSC configured to drive the e-pen signal having thefirst frequency via another single line coupling to the e-pen sensorelectrode of the e-pen.
 17. The system of claim 15, wherein the touchsensor device further comprising: a memory that stores operationalinstructions; and a processing module operably coupled to the DSC and tothe memory, wherein, when enabled, the processing module configured toexecute the operational instructions to process the digital signal todetect the interaction of the e-pen with the touch sensor device. 18.The system of claim 15, wherein the e-pen is a wireless e-pen.
 19. Thesystem of claim 15, wherein the DSC further comprising: a power sourcecircuit operably coupled to the touch sensor electrode via the singleline, wherein, when enabled, the power source circuit configured toprovide the touch sensor signal that includes an analog signal via thesingle line coupling to the touch sensor electrode, and wherein theanalog signal includes at least one of a DC (direct current) componentor an oscillating component; and a power source change detection circuitoperably coupled to the power source circuit, wherein, when enabled, thepower source change detection circuit is configured to: detect an effecton the analog signal that is based on the electrical characteristic ofthe touch sensor electrode; and generate the digital signal that isrepresentative of the electrical characteristic of the touch sensorelectrode.
 20. The system of claim 19, wherein the DSC furthercomprising: the power source circuit including a power source to sourceat least one of a voltage or a current to the touch sensor electrode viathe single line; and the power source change detection circuitincluding: a power source reference circuit configured to provide atleast one of a voltage reference or a current reference; and acomparator configured to compare the at least one of the voltage and orthe current provided to the touch sensor electrode to the at least oneof the voltage reference or the current reference, respectively, toproduce the analog signal.